H077LL1A-1K
Plastronics
H077LL1A-1K
Plastronics
SPRING PROBE .77MM X 4.45MM HPIN
Reference Price (USD)
1+
$866.67000
500+
$858.0033
1000+
$849.3366
1500+
$840.6699
2000+
$832.0032
2500+
$823.3365
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
H077LL1A-1K
$866.67
Product details
The H077LL1A-1K by Plastronics redefines Contacts, Spring Loaded (Pogo Pins), and Pressure performance in high-speed computing applications, featuring {Mating Cycles} mating cycles with exceptional signal integrity. Engineered with {Contact Finish} plating at {Contact Finish Thickness}, these contacts deliver superior EMI shielding for server backplanes and data center equipment.Utilizing Probe Pin technology, these contacts maintain impedance control for high-speed differential pairs up to 56Gbps.The Surface Mount configuration enables high-density PCB layouts required in next-generation computing hardware.For optimal signal reflection characteristics, implement 0.148" (3.77mm) as the working height.18.1gf initial contact force prevents signal bounce during hot-swap operations.Precisely calibrated 34.9gf mid-compression force maintains connection stability during thermal cycling.The 0.150" ~ 0.740" (3.81mm ~ 18.80mm) plunger diameter is optimized for both high-frequency performance and mechanical endurance.Advanced Beryllium Copper alloy provides the ideal combination of conductivity and thermal management.
Product Attributes
- Product Status: Active
- Contact Type: Probe Pin
- Mounting Type: Surface Mount
- Maximum Working Height: -
- Recommended Working Height: 0.148" (3.77mm)
- Minimum Working Height: -
- Pad Layout Dimension: -
- Operating Force - Initial: 18.1gf
- Operating Force - Mid Compression: 34.9gf
- Plunger Size: 0.150" ~ 0.740" (3.81mm ~ 18.80mm)
- Features: -
- Mating Cycles: 125000
- Contact Material: Beryllium Copper
- Contact Finish: Gold
- Contact Finish Thickness: -
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