HC1000-0.020-02-0404

The HC1000-0.020-02-0404 from Bergquist delivers military-grade Thermal - Pads, Sheets solutions for harsh environment electronics. This extreme-duty thermal interface material meets MIL-STD-810 requirements while providing reliable thermal management for defense and aerospace systems.As a MIL-spec Pad, Sheet, this product combines extreme temperature stability with vibration resistance. The specially formulated matrix withstands 50G mechanical shock while maintaining perfect thermal contact.Precision-manufactured in Square configurations, this material meets tight military tolerances. The laser-cut edges ensure perfect fitment in ruggedized enclosures with strict dimensional requirements.With 101.60mm x 101.60mm dimensions, this solution accommodates standard military electronic packaging. The size-optimized design allows for efficient thermal management in space-constrained armored vehicles and aircraft systems.Featuring ultra-tight 0.0200" (0.508mm) tolerances ( 0.01mm), this material ensures reliable interface contact under vibration. The controlled compression characteristics maintain optimal thermal transfer in dynamic environments.Formulated with mil-spec Polymer, this pad exhibits exceptional resistance to fuels and hydraulic fluids. This property ensures long-term reliability in engine compartments and weapons systems.Featuring Tacky - Both Sides properties, this solution offers instant bonding in field repair situations. The high-tack formulation ensures immediate attachment even in dusty or oily conditions.The Fiberglass system meets military handling requirements. This reinforced backing survives rough handling during field installation while preventing material contamination.The Gray coding system complies with military identification standards. This standardized coloring facilitates quick material verification during field maintenance operations.Delivering 1.0W/m-K performance, this material enables effective cooling in armored electronics. The anisotropic properties provide directional heat flow for targeted cooling of high-power components.