HD6417709F80B

Renesas Electronics America Inc

General info

Part Number

HD6417709F80B

Manufacturer

Renesas Electronics America Inc

Description:

IC MCU 32BIT ROMLESS

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HD6417709F80B

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Product details

The HD6417709F80B from Renesas Electronics America Inc represents a cutting-edge solution in Embedded - Microcontrollers, engineered for mission-critical embedded systems. This microcontroller combines robust processing capabilities with exceptional signal integrity, making it ideal for 5G infrastructure and industrial automation applications where timing precision is paramount.Featuring an SH-3 architecture, this IC delivers deterministic performance for real-time control applications. When paired with its advanced clock generation circuits, it achieves superior processing efficiency compared to conventional designs.With its 32-Bit Single-Core data path architecture, the device enables concurrent processing of multiple sensor inputs while maintaining ultra-low latency - a critical requirement for industrial IoT edge nodes.Operating at 80MHz, the microcontroller provides the ideal balance between power consumption and throughput, particularly beneficial for battery-powered field instruments requiring extended operational life.With 96 configurable GPIOs, designers can implement complex control matrices while maintaining spare capacity for future expansion, particularly valuable in modular industrial equipment.ROMless technology ensures rapid boot times and exceptional data retention, outperforming traditional storage methods in harsh environmental conditions.A 16K x 8 volatile memory configuration supports multi-threaded operation with zero-wait-state access, enabling deterministic response times in motor control applications.Precision A/D 8x10b; D/A 2x8b provide <1 LSB nonlinearity for accurate sensor signal conditioning, particularly important in medical diagnostic equipment where measurement accuracy is critical.The Internal clock source implementation reduces BOM costs while maintaining jitter performance below 1% of period, meeting stringent RF communication requirements.Rated for -40°C ~ 85°C, this microcontroller maintains timing stability across extreme environmental conditions, making it suitable for downhole drilling instrumentation.Surface Mount packaging enables high-density PCB layouts while withstanding mechanical stress, ideal for vibration-prone automotive underhood applications.The 208-LQFP format provides optimal thermal dissipation for continuous operation at maximum clock speeds, addressing thermal challenges in sealed industrial enclosures.