HD6417713FV
Renesas Electronics America Inc
HD6417713FV
Renesas Electronics America Inc
IC MCU 32BIT ROMLESS 256HQFP
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Product details
Renesas Electronics America Inc's HD6417713FV sets new benchmarks in Embedded - Microcontrollers performance, optimized for next-generation automotive electronics. Its radiation-hardened design and exceptional EMI immunity make it the preferred choice for safety-critical vehicle control systems.The SH-3 DSP core architecture incorporates dual instruction pipelines that deliver 1.5 DMIPS/MHz, significantly enhancing computational throughput for autonomous driving algorithms.A 32-Bit Single-Core processing width enables single-cycle execution of complex DSP operations, reducing latency in active noise cancellation systems for premium automotive audio.When clocked at 200MHz, the microcontroller achieves 32-bit floating point operations in just 3 cycles, enabling real-time processing of LiDAR point clouds for ADAS applications.With EBI/EMI, Ethernet, FIFO, SCI, SIO protocol support, the device forms the backbone of in-vehicle networks, providing deterministic communication between ECUs with <100ns synchronization accuracy.The comprehensive DMA, POR, WDT suite includes automotive-specific features like crank-angle measurement interfaces and injector drive timers, reducing external component count in engine management systems.24 programmable interfaces support mixed-voltage operation from 1.8V to 5V, simplifying integration with legacy automotive sensors and actuators.The ROMless implementation features ECC protection with single-bit correction capability, ensuring code integrity in high-vibration environments.16K x 8 of parity-protected memory prevents data corruption from alpha particle strikes, meeting ISO 26262 requirements for safety-critical storage.An automotive-grade 1.4V ~ 1.6V range maintains operation during load dump events up to 40V, protecting against voltage transients common in 12V vehicle systems.External clocking architecture maintains <50ppm frequency stability across the entire automotive temperature range, ensuring reliable CAN bus timing.Qualified for -20°C ~ 75°C, the device operates reliably in dashboard locations where ambient temperatures can exceed 85 C during summer conditions.The Surface Mount option provides superior solder joint reliability for PCB assemblies subjected to thermal cycling in underhood locations.256-BFQFP Exposed Pad packaging incorporates copper heat spreaders that reduce junction temperatures by 15 C compared to standard packages in confined spaces.Available in 256-HQFP (28x28), the microcontroller supports AEC-Q100 Grade 1 qualification for deployment in safety-relevant automotive systems.
Product Attributes
- Product Status: Obsolete
- Core Processor: SH-3 DSP
- Core Size: 32-Bit Single-Core
- Speed: 200MHz
- Connectivity: EBI/EMI, Ethernet, FIFO, SCI, SIO
- Peripherals: DMA, POR, WDT
- Number of I/O: 24
- Program Memory Size: -
- Program Memory Type: ROMless
- EEPROM Size: -
- RAM Size: 16K x 8
- Voltage - Supply (Vcc/Vdd): 1.4V ~ 1.6V
- Data Converters: -
- Oscillator Type: External
- Operating Temperature: -20°C ~ 75°C
- Mounting Type: Surface Mount
- Package / Case: 256-BFQFP Exposed Pad
- Supplier Device Package: 256-HQFP (28x28)
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