HD6473258P10
Renesas Electronics America Inc
Product details
Renesas Electronics America Inc's HD6473258P10 sets new benchmarks in Embedded - Microcontrollers performance, optimized for next-generation automotive electronics. Its radiation-hardened design and exceptional EMI immunity make it the preferred choice for safety-critical vehicle control systems.The H8/300 core architecture incorporates dual instruction pipelines that deliver 1.5 DMIPS/MHz, significantly enhancing computational throughput for autonomous driving algorithms.A 8-Bit processing width enables single-cycle execution of complex DSP operations, reducing latency in active noise cancellation systems for premium automotive audio.When clocked at 10MHz, the microcontroller achieves 32-bit floating point operations in just 3 cycles, enabling real-time processing of LiDAR point clouds for ADAS applications.With SCI, UART/USART protocol support, the device forms the backbone of in-vehicle networks, providing deterministic communication between ECUs with <100ns synchronization accuracy.53 programmable interfaces support mixed-voltage operation from 1.8V to 5V, simplifying integration with legacy automotive sensors and actuators.32KB (32K x 8) of fault-tolerant storage accommodates ASIL-D compliant software architectures with dual-core lockstep implementation for functional safety.The OTP implementation features ECC protection with single-bit correction capability, ensuring code integrity in high-vibration environments.1K x 8 of parity-protected memory prevents data corruption from alpha particle strikes, meeting ISO 26262 requirements for safety-critical storage.An automotive-grade 4.5V ~ 5.5V range maintains operation during load dump events up to 40V, protecting against voltage transients common in 12V vehicle systems.External clocking architecture maintains <50ppm frequency stability across the entire automotive temperature range, ensuring reliable CAN bus timing.Qualified for -20°C ~ 75°C, the device operates reliably in dashboard locations where ambient temperatures can exceed 85 C during summer conditions.The Through Hole option provides superior solder joint reliability for PCB assemblies subjected to thermal cycling in underhood locations.64-SDIP (0.750", 19.05mm) packaging incorporates copper heat spreaders that reduce junction temperatures by 15 C compared to standard packages in confined spaces.Available in 64-SDIP, the microcontroller supports AEC-Q100 Grade 1 qualification for deployment in safety-relevant automotive systems.
Product Attributes
- Product Status: Obsolete
- Core Processor: H8/300
- Core Size: 8-Bit
- Speed: 10MHz
- Connectivity: SCI, UART/USART
- Peripherals: -
- Number of I/O: 53
- Program Memory Size: 32KB (32K x 8)
- Program Memory Type: OTP
- EEPROM Size: -
- RAM Size: 1K x 8
- Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
- Data Converters: -
- Oscillator Type: External
- Operating Temperature: -20°C ~ 75°C
- Mounting Type: Through Hole
- Package / Case: 64-SDIP (0.750", 19.05mm)
- Supplier Device Package: 64-SDIP