HDTM-3-06-1-S-VT-0-1
Samtec Inc.
HDTM-3-06-1-S-VT-0-1
Samtec Inc.
CONN HEADER XCEDE 36POS PCB
Reference Price (USD)
1+
$10.36000
500+
$10.2564
1000+
$10.1528
1500+
$10.0492
2000+
$9.9456
2500+
$9.842
Exquisite packaging
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HDTM-3-06-1-S-VT-0-1
$10.36
Product details
Samtec Inc.'s HDTM-3-06-1-S-VT-0-1 redefines Backplane Connectors - Specialized technology for aerospace satellite payload systems. This space-grade connector solution combines radiation-hardened materials with ultra-high-frequency performance for next-generation communications satellites.Specifically engineered for Backplane applications, this series excels in GEO communications payloads.The Header, Male Blades interface configuration meets MIL-DTL-38999 Series III requirements while supporting Ka-band signal transmission.Featuring XCede® technology, this series provides reliable RF performance in vacuum and thermal cycling environments.With 36 contact positions, the connector enables comprehensive payload subsystem integration in smallsat constellations.The All loaded configuration offers mass-optimized solutions for deployable satellite mechanisms.The 6 column arrangement supports high-speed data buses in Earth observation payloads.The Through Hole mounting system ensures mechanical stability during launch vehicle vibration profiles.The Press-Fit method has been qualified for wire-wrap reliability in zero-gravity conditions.Gold plating technology exceeds ESA ECSS-Q-ST-70-08C requirements for space connector reliability.30.0µin (0.76µm) coating thickness ensures long-term performance in atomic oxygen environments.
Product Attributes
- Product Status: Active
- Connector Usage: Backplane
- Connector Type: Header, Male Blades
- Connector Style: XCede®
- Number of Positions: 36
- Number of Positions Loaded: All
- Pitch: -
- Number of Rows: -
- Number of Columns: 6
- Mounting Type: Through Hole
- Termination: Press-Fit
- Contact Layout, Typical: -
- Features: -
- Contact Finish: Gold
- Contact Finish Thickness: 30.0µin (0.76µm)
- Color: -
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