HDTM-4-06-1-S-VT-0-1
Samtec Inc.
Product details
The HDTM-4-06-1-S-VT-0-1 by Samtec Inc. revolutionizes Backplane Connectors - Specialized technology, specifically engineered for hyperscale data center applications. This high-density interconnect solution delivers unmatched signal integrity while supporting next-generation computing architectures.Specifically developed for Backplane implementations, this series excels in co-packaged optics interconnect applications.Featuring Header, Male Blades configuration, this connector series provides optimal performance for 224G PAM4 signaling in switch fabric applications.The XCede® design incorporates advanced crosstalk suppression techniques, critical for maintaining eye diagram integrity in high-speed serial links.With 48 available positions, this solution enables unprecedented port density for top-of-rack switching equipment.The All loaded variant offers power-efficient solutions for partial population scenarios in server backplanes.The 6 column architecture enables efficient routing of wide parallel buses in memory-centric computing systems.Through Hole installation method ensures precise coplanarity for reliable surface-mount assembly in automated PCB production lines.The Press-Fit process has been optimized for low-void solder joints in mass reflow processes per IPC-7095C standards.Gold plating technology provides superior wear resistance exceeding 10,000 mating cycles for data center hot-swap scenarios.30.0µin (0.76µm) coating thickness ensures compliance with IEC 60512-99-001 fretting corrosion requirements.
Product Attributes
- Product Status: Active
- Connector Usage: Backplane
- Connector Type: Header, Male Blades
- Connector Style: XCede®
- Number of Positions: 48
- Number of Positions Loaded: All
- Pitch: -
- Number of Rows: -
- Number of Columns: 6
- Mounting Type: Through Hole
- Termination: Press-Fit
- Contact Layout, Typical: -
- Features: -
- Contact Finish: Gold
- Contact Finish Thickness: 30.0µin (0.76µm)
- Color: -