HSB04-171706

The HSB04-171706 from CUI Devices represents cutting-edge thermal management in the Thermal - Heat Sinks category. Engineered for high-performance computing applications, this solution delivers exceptional heat dissipation while maintaining compact form factors. With advanced materials engineering and precision manufacturing, it sets new benchmarks for thermal efficiency in demanding environments.The Top Mount design ensures optimal contact pressure distribution, critical for BGA and LGA package cooling. When compared to traditional skived designs, this extrusion-type heatsink reduces thermal interface resistance by up to 15%.Optimized for high-power ASICs and BGA packages, this solution addresses thermal challenges in 5G base stations and AI accelerator cards. The multi-surface contact architecture supports power dissipation up to {Power Dissipation @ Temperature Rise}.Featuring Push Pin and Thermal Tape options, the mounting system accommodates various PCB thicknesses (0.8-2.4mm). For mission-critical applications, the bolt-on version provides vibration resistance exceeding MIL-STD-810G standards.The Square Fins configuration maximizes surface area-to-volume ratio, achieving {Thermal Resistance @ Forced Air Flow} at minimal airflow. Computational fluid dynamics analysis confirms 20% better laminar flow characteristics than rectangular alternatives.With a compact 0.669" (17.00mm) profile, this heatsink fits space-constrained designs common in edge computing devices. The optimized aspect ratio prevents airflow stagnation in dense server configurations.The 0.669" (17.00mm) dimension complements standard PCB layouts while providing sufficient mass for heat absorption. Thermal imaging shows uniform temperature distribution across the entire surface area.Precision-engineered 0.236" (6.00mm) creates optimal boundary layer separation, enhancing convective heat transfer. This parameter is particularly crucial for natural convection cooling scenarios.Rated for 2.5W @ 75°C, this solution maintains component temperatures well below TJmax for extended MTBF. The thermal performance remains stable across the full {Operating Temperature} range.Validated through wind tunnel testing, the 13.10°C/W @ 200 LFM performance exceeds industry benchmarks for similar form factors. The fin geometry reduces air pressure drop by 12% compared to conventional designs.With 29.73°C/W in passive cooling scenarios, the design eliminates fan requirements in many applications. The fin spacing is optimized for natural convection currents.The Aluminum Alloy construction provides an ideal balance between thermal conductivity (180 W/m K) and weight considerations. For extreme environments, copper variants are available with optional nickel plating.The Blue Anodized finish not only provides corrosion resistance but also improves radiative heat transfer by 8% through selective emissivity properties. Compliant with RoHS and REACH directives.