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HSB22-606010

CUI Devices
HSB22-606010 Preview
HSB22-606010
CUI Devices
HEAT SINK, BGA, 60 X 60 X 10 MM
Reference Price (USD)
1+
$2.37248
500+
$2.3487552
1000+
$2.3250304
1500+
$2.3013056
2000+
$2.2775808
2500+
$2.253856
Exquisite packaging
Discount
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HSB22-606010

HSB22-606010

$2.37

Product details

Product Attributes

  • Product Status: Active
  • Type: Top Mount
  • Package Cooled: BGA
  • Attachment Method: Adhesive
  • Shape: Square, Pin Fins
  • Length: 2.362" (60.00mm)
  • Width: 2.362" (60.00mm)
  • Diameter: -
  • Fin Height: 0.394" (10.00mm)
  • Power Dissipation @ Temperature Rise: 9.8W @ 75°C
  • Thermal Resistance @ Forced Air Flow: 2.60°C/W @ 200 LFM
  • Thermal Resistance @ Natural: 7.62°C/W
  • Material: Aluminum
  • Material Finish: Black Anodized

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