HSB28-606022
CUI Devices
HSB28-606022
CUI Devices
HEAT SINK, BGA, 60 X 60 X 22 MM,
Reference Price (USD)
1+
$6.63000
500+
$6.5637
1000+
$6.4974
1500+
$6.4311
2000+
$6.3648
2500+
$6.2985
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
HSB28-606022
$6.63
Product details
CUI Devices's HSB28-606022 delivers breakthrough thermal performance for data center applications in the Thermal - Heat Sinks category. Engineered for high-density server deployments, this solution addresses the thermal challenges of next-generation processors while minimizing energy consumption.
Product Attributes
- Product Status: Active
- Type: -
- Package Cooled: -
- Attachment Method: -
- Shape: -
- Length: -
- Width: -
- Diameter: -
- Fin Height: -
- Power Dissipation @ Temperature Rise: -
- Thermal Resistance @ Forced Air Flow: -
- Thermal Resistance @ Natural: -
- Material: -
- Material Finish: -
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