HSB30-373710
CUI Devices
HSB30-373710
CUI Devices
HEAT SINK, BGA, 37.4 X 37 X 10 M
Reference Price (USD)
1+
$2.24000
500+
$2.2176
1000+
$2.1952
1500+
$2.1728
2000+
$2.1504
2500+
$2.128
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
HSB30-373710
$2.24
Product details
Optimized for automotive electronics, the HSB30-373710 by CUI Devices sets new standards in Thermal - Heat Sinks reliability. This AEC-Q200 qualified thermal solution addresses unique challenges in electric vehicle power systems, combining robust construction with exceptional thermal performance.
Product Attributes
- Product Status: Active
- Type: -
- Package Cooled: -
- Attachment Method: -
- Shape: -
- Length: -
- Width: -
- Diameter: -
- Fin Height: -
- Power Dissipation @ Temperature Rise: -
- Thermal Resistance @ Forced Air Flow: -
- Thermal Resistance @ Natural: -
- Material: -
- Material Finish: -
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