HSC-03

The HSC-03 by CUI Devices sets new standards in the Thermal - Accessories segment through its multi-functional thermal regulation capabilities. This advanced component is specifically designed to meet the rigorous demands of 5G infrastructure and automotive power electronics.Functioning as a high-efficiency Heat Sink Clip, this solution incorporates graphene-enhanced thermal paths that outperform traditional materials by 40% in thermal conductivity tests. Its unique spring-loaded mechanism guarantees consistent pressure across thermal cycling conditions.Engineered for optimal performance with HSE-B20350-NP, HSE-BX-02 and HSE-BX-035H-02 Series, this thermal management accessory features a fail-safe retention system. The innovative clip geometry ensures reliable operation even under extreme temperature fluctuations common in TO-style heat sink applications.