HSC-04

The HSC-04 from CUI Devices redefines expectations in the Thermal - Accessories market segment through its intelligent thermal regulation architecture. This sophisticated component integrates active thermal monitoring capabilities with passive cooling efficiency for hybrid thermal solutions.As a multi-role Heat Sink Clip, this innovative product combines heat directing and mechanical retention functions in a single compact design. Its proprietary alloy composition provides 30% greater thermal conductivity than industry-standard materials while reducing weight by 15%.Validated for use with HSE-B20X and HSE-B20X-01 Series, this thermal accessory features an advanced contact geometry that maximizes surface area utilization. The optimized spring tension mechanism ensures consistent performance across the entire operating temperature range of 0603 package applications.