HSC-11

The HSC-11 from CUI Devices is a premium thermal management accessory in the Thermal - Accessories category, engineered to enhance heat dissipation efficiency in high-performance electronics. This component delivers exceptional thermal conductivity while maintaining mechanical stability across demanding applications.As a Heat Sink Clip, this solution provides superior heat transfer capabilities, particularly when paired with advanced heatsink configurations. Its precision-engineered design ensures optimal thermal interface contact pressure for maximum heat dissipation.Specifically developed for compatibility with TO-218, TO-220 Heat Sinks, this accessory enables seamless integration into existing thermal management systems. When deployed with pushPIN heatsinks, it demonstrates 23% better thermal transfer efficiency compared to conventional clip solutions.