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HSE08-505028

CUI Devices
HSE08-505028 Preview
HSE08-505028
CUI Devices
HEAT SINK, EXTRUSION, TO-218/TO-
Reference Price (USD)
1+
$2.46000
500+
$2.4354
1000+
$2.4108
1500+
$2.3862
2000+
$2.3616
2500+
$2.337
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
HSE08-505028

HSE08-505028

$2.46

Product details

Product Attributes

  • Product Status: Active
  • Type: Board Level
  • Package Cooled: TO-218, TO-220
  • Attachment Method: Clip
  • Shape: Rectangular, Angled Fins
  • Length: 1.969" (50.00mm)
  • Width: 1.102" (28.00mm)
  • Diameter: -
  • Fin Height: 1.969" (50.00mm)
  • Power Dissipation @ Temperature Rise: 10.53W @ 75°C
  • Thermal Resistance @ Forced Air Flow: 2.70°C/W @ 200 LFM
  • Thermal Resistance @ Natural: 7.13°C/W
  • Material: Aluminum Alloy
  • Material Finish: Black Anodized

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