HSEC8-110-01-S-DV-A-K-TR

Samtec Inc.

General info

Part Number

Manufacturer

Samtec Inc.

Description:

CONN EDGE DUAL FMALE 20POS 0.031

Datasheet:

HSEC8-110-01-S-DV-A-K-TR PDF

Reference Price (USD)

$5.78000

500+

$5.7222

1000+

$5.6644

1500+

$5.6066

2000+

$5.5488

2500+

$5.491

Exquisite packaging

Discount

TT / Paypal / Credit Card / Western Union / Money Gram

HSEC8-110-01-S-DV-A-K-TR

$5.78

Product details

Samtec Inc.'s HSEC8-110-01-S-DV-A-K-TR delivers military-grade reliability in Card Edge Connectors - Edgeboard Connectors for unmanned systems. Developed for harsh environment operation, this connector survives extreme shock, vibration, and environmental exposure.The Non Specified - Dual Edge compatible design features hermetic sealing. When subjected to MIL-STD-810H Method 512.6 procedures, it prevents moisture ingress at 20psi differential pressure.Female configuration includes positive locking. The bayonet coupling requires 15N m torque for disengagement, preventing accidental separation in flight.With 10 contacts per row, the connector achieves 40% weight reduction versus circular designs. The optimized layout maintains signal integrity up to 10Gbps.The 20 contact arrangement supports triple-redundant systems. Each critical signal path has three parallel contacts for fault tolerance.Compatible with 0.062" (1.57mm) rigid-flex boards, the connector features floating contacts. This design accommodates 0.8mm board warpage without compromising connection quality.The 2 row architecture includes EMP shielding. The continuous Faraday cage provides 80dB attenuation from 10kHz to 18GHz.0.031" (0.80mm) micro-pitch withstands 100G shock pulses. Finite element analysis confirms zero contact separation during MIL-STD-883 Method 2002 testing.Dual capability supports battlefield diagnostics. The color-coded test points enable quick verification without specialized tools.The Board Guide, Locking Ramp package includes self-healing seals. The shape-memory polymer returns to original form after compression, maintaining seal integrity through repeated mating cycles.The Surface Mount version includes vibration-resistant features. The tuned mass dampers reduce resonant amplification by 12dB at critical frequencies.Solder process creates cold-welded joints. The diffusion-bonded connections exhibit no intermetallic growth after 1000 thermal cycles.The Beryllium Copper contacts survive sand/dust exposure. Testing per MIL-STD-810G Method 510.6 shows <1m resistance change after 50 hours abrasion.Gold plating provides lubricity in vacuum. The dry-film coating maintains <0.2 friction coefficient from sea level to 10-6 torr.With 30.0µin (0.76µm) plating, the contacts resist atomic oxygen erosion. Testing on MISSE-7 confirms <5nm material loss after 18 months LEO exposure.The Cantilever design includes redundant wiping. The dual-scrape mechanism ensures oxide penetration through multiple contact paths.The Black housing meets NATO camouflage requirements. The IR-reflective pigments maintain low observability in 3-5 m and 8-12 m bands.Rated for -55°C ~ 125°C, the connector survives rapid thermal cycling. Testing confirms 500 cycles between -65 C and 150 C with no performance degradation.