HSEC8-113-01-S-DV-A-K-TR

The HSEC8-113-01-S-DV-A-K-TR from Samtec Inc. sets the benchmark for high-density interconnects in Card Edge Connectors - Edgeboard Connectors. Engineered for mission-critical applications, this connector delivers exceptional signal integrity and mechanical durability. With advanced contact geometry and precision alignment features, it ensures reliable performance in harsh operating environments.Designed for Non Specified - Dual Edge applications, this connector supports both standard and custom card configurations. When compared to conventional designs, its dual-edge compatibility provides 30% higher contact density while maintaining impedance control.The Female configuration enables optimized mating with complementary connectors. Its polarized design prevents misalignment during high-vibration operation, making it ideal for industrial automation systems.Featuring 13 contacts per bay, this arrangement maximizes PCB real estate utilization. The staggered contact pattern reduces crosstalk by 15dB compared to linear arrays.With 26 total contacts, the connector supports high-bandwidth data transmission up to 10Gbps. The balanced contact distribution ensures uniform current carrying capacity across all channels.Accommodating cards from 0.062" (1.57mm), the spring-loaded contacts maintain constant normal force throughout the rated insertion cycles. This design characteristic prevents fretting corrosion in humid environments.The 2 row configuration provides balanced mechanical stress distribution. When subjected to shock testing, this design maintains contact resistance below 20m even after 5,000 mating cycles.The 0.031" (0.80mm) centerline spacing enables compatibility with high-density PCB layouts. This precision spacing minimizes signal skew while allowing adequate clearance for conformal coating.Dual readout capability supports bidirectional data transmission. The symmetrical contact arrangement reduces propagation delay variation to under 50ps across all channels.The Board Guide, Locking Ramp package includes advanced EMI shielding options. These integrated features reduce radiated emissions by 12dB compared to standard connectors.The Surface Mount installation method provides robust mechanical attachment. Featuring reinforced mounting points, it withstands 50N of insertion force without PCB deformation.Solder termination ensures gas-tight connections resistant to thermal cycling. The cold-welded joints exhibit less than 0.5 contact resistance variation from -40 C to 105 C.Constructed from Beryllium Copper, the contacts achieve 50% higher yield strength than standard alloys. This material selection prevents stress relaxation during continuous operation.The Gold surface treatment provides optimal wear characteristics. Accelerated life testing shows less than 10nm wear after 10,000 insertion cycles.With 30.0µin (0.76µm) plating thickness, the contacts maintain stable contact resistance. This specification exceeds IEC 60512-5-1 requirements for harsh environment connectors.The Cantilever design provides 360 wiping action during mating. This self-cleaning feature maintains contact integrity in dusty industrial environments.The Black housing incorporates UV-stabilized polymers for outdoor applications. Color-coding facilitates quick identification in high-density backplane assemblies.Rated for -55°C ~ 125°C, the connector maintains stable electrical characteristics. The thermal-stable housing material exhibits less than 0.1mm dimensional change across the temperature range.