HSEC8-125-01-L-RA-BL-L2

Samtec Inc.'s HSEC8-125-01-L-RA-BL-L2 represents a breakthrough in Card Edge Connectors - Edgeboard Connectors technology for next-generation systems. Optimized for high-speed digital interfaces, this connector combines superior electrical performance with ruggedized construction for demanding applications.Supporting Non Specified - Dual Edge standards, the connector features adaptive contact geometry. This innovative design automatically compensates for card thickness variations up to 0.015" during insertion.The Female configuration incorporates patented contact protection. When unmated, spring-loaded shutters prevent contamination ingress, meeting IP67 requirements when properly panel-mounted.With 25 contacts per row, the layout achieves 40% higher density than previous generations. The optimized contact spacing minimizes near-end crosstalk (NEXT) below -60dB at 6GHz.The 50 total contacts support parallel bus architectures. Each contact path is individually tuned to maintain characteristic impedance within 5% of nominal value.Compatible with 0.062" (1.57mm) cards, the connector features graduated contact beams. This multi-stage wiping action ensures reliable connections even with warped or slightly misaligned cards.The 2 row arrangement incorporates ground contacts between signal pairs. This configuration provides 30 controlled impedance for high-speed differential signals.The 0.031" (0.80mm) pitch design enables 28Gbps NRZ signaling. Precision-molded dielectric spacers maintain consistent propagation velocity across all contact pairs.Dual readout capability supports advanced diagnostic monitoring. Integrated test points allow in-circuit verification without disassembly.The Board Guide, Board Lock, Latches package includes EMI gaskets and grounding clips. These options reduce common-mode noise by 18dB in 1-6GHz frequency range.Surface Mount, Right Angle installation features anti-walk pegs. These positive retention features prevent connector movement during vibration per MIL-STD-810G Method 514.7.The Solder method creates metallurgical bonds without thermal degradation. Process controls maintain peak reflow temperatures below 260 C for lead-free assembly compatibility.Beryllium Copper contacts exhibit exceptional stress relaxation resistance. After 1,000 hours at 125 C, contact force remains within 90% of initial value.The Gold surface treatment provides superior corrosion resistance. Salt spray testing per ASTM B117 shows no degradation after 500 hours exposure.With 10.0µin (0.25µm) plating, the contacts achieve <5m insertion resistance. This specification supports power delivery up to 3A per contact.The Cantilever design incorporates redundant contact points. This dual-touch architecture provides fault-tolerant connections for safety-critical systems.The Black housing material includes halogen-free flame retardants. Compliant with UL94 V-0 requirements, it prevents flame propagation in vertical burn tests.Rated for -55°C ~ 125°C, the connector uses thermally matched materials. Coefficient of thermal expansion (CTE) is controlled within 12ppm/ C to prevent thermal cycling failures.