HSEC8-150-01-S-D-EM2

Samtec Inc.

General info

Part Number

Manufacturer

Samtec Inc.

Description:

CONN EDGE DUAL FMALE 100P 0.031

Datasheet:

HSEC8-150-01-S-D-EM2 PDF

Reference Price (USD)

$20.22000

500+

$20.0178

1000+

$19.8156

1500+

$19.6134

2000+

$19.4112

2500+

$19.209

Exquisite packaging

Discount

TT / Paypal / Credit Card / Western Union / Money Gram

HSEC8-150-01-S-D-EM2

$20.22

Product details

Designed for precision interconnect solutions, Samtec Inc.'s HSEC8-150-01-S-D-EM2 Card Edge Connectors - Edgeboard Connectors delivers unmatched reliability in high-vibration environments. Developed for aerospace and defense applications, this connector meets rigorous MIL-SPEC performance requirements.The Non Specified - Dual Edge compatible design features guided card entry. Angulated lead-ins prevent card edge damage during blind mating operations.Female configuration incorporates positive latching mechanism. The over-center latch design requires 25N minimum release force to prevent accidental unmating.With 50 contacts per bay, the connector achieves 98% contact engagement probability. Statistical process controls maintain 0.002" contact position tolerance.The 100 contact arrangement supports redundant power distribution. Parallel power contacts reduce current density by 40% compared to single-contact designs.Accommodating 0.062" (1.57mm) cards, the connector features dual-beam contacts. This balanced force design prevents card deformation during insertion.The 2 row configuration includes integrated ground planes. These continuous reference surfaces maintain signal return paths for controlled impedance.0.031" (0.80mm) pitch design enables 56Gbps PAM4 signaling. The air dielectric between contacts minimizes dielectric loss at millimeter-wave frequencies.Dual readout capability supports hot-swap applications. Staggered contact lengths provide make-first/break-last sequencing for safe board insertion.The Board Edge, Straddle Mount version includes conductive backshell. This Faraday cage design provides 360 EMI shielding effectiveness >60dB at 10GHz.Solder process creates void-free solder joints. Automated optical inspection (AOI) verifies complete fillet formation on all terminations.The Beryllium Copper contacts exhibit excellent thermal conductivity. This property helps dissipate heat generated by contact resistance.Gold plating provides durable wear surface. Micro-hardness testing shows Knoop hardness >200HK for extended mating cycle life.With 30.0µin (0.76µm) gold plating, the contacts achieve <2m contact resistance. This low resistance minimizes voltage drop in power distribution applications.The Cantilever design includes integrated wiping action. Each mating cycle removes surface oxides through 0.5mm of controlled contact wipe.Black housing incorporates radiopaque markers. These features enable X-ray inspection of fully assembled systems.Rated for -55°C ~ 125°C, the connector uses cryogenic-grade materials. Glass transition temperature exceeds maximum operating temperature by 50 C margin.