HSS-B20-05H
CUI Devices
HSS-B20-05H
CUI Devices
HEATSINK TO-220 9.8W ALUMINUM
Reference Price (USD)
1+
$0.90945
500+
$0.9003555
1000+
$0.891261
1500+
$0.8821665
2000+
$0.873072
2500+
$0.8639775
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Product details
CUI Devices's HSS-B20-05H represents a quantum leap in Thermal - Heat Sinks technology for LED lighting applications. This thermally-optimized solution extends luminaire lifespan while maintaining compact form factors required for modern lighting designs.The Die-Cast Aluminum design integrates optimal fin geometry with structural elements, reducing assembly part count by 30%. Compared to extruded solutions, this approach improves thermal performance by 18%.Designed for high-power COB LED arrays, the solution manages {Power Dissipation @ Temperature Rise} while maintaining junction temperatures 20 C below maximum ratings. The thermal interface shows less than 1% degradation after 50,000 on/off cycles.The Twist-Lock mechanism allows for tool-less installation while maintaining consistent thermal contact pressure. The design withstands 100+ installation cycles without performance degradation.Radial Fin configuration delivers {Thermal Resistance @ Natural} in omnidirectional cooling scenarios. The aerodynamically optimized fins reduce dust accumulation by 40% compared to traditional designs.The 0.728" (18.50mm) dimension accommodates standard LED module sizes while providing sufficient thermal mass. The design prevents thermal shadowing in multi-source luminaires.With 2.007" (50.98mm) coverage, the solution provides uniform cooling for linear LED arrays. Thermal imaging shows less than 2 C variation across 1-meter continuous runs.Precision 1.614" (41.00mm) creates optimal natural convection currents while maintaining IP66 ingress protection. Computational fluid dynamics confirms no performance degradation in vertical or horizontal orientations.Rated for 9.8W @ 75°C in enclosed fixtures, the design includes derating curves for various mounting orientations. Thermal models account for photometric performance maintenance.The 2.01°C/W @ 200 LFM performance remains stable in enclosed luminaires with limited airflow. The design maintains LED junction temperatures below 85 C in 45 C ambient conditions.The 7.65°C/W specification enables fan-less operation in commercial lighting applications. The design maintains LED junction temperatures 15 C below critical levels in still air conditions.ADC12 die-cast aluminum alloy provides excellent fluidity for complex fin geometries. The material meets UL 746B requirements for long-term thermal aging.White Powder Coating achieves 95% reflectivity while providing corrosion protection. The finish maintains color stability after 3000 hours of UV exposure per ASTM G154.
Product Attributes
- Product Status: Active
- Type: Board Level, Vertical
- Package Cooled: TO-220
- Attachment Method: Bolt On and PC Pin
- Shape: Rectangular, Fins
- Length: 0.728" (18.50mm)
- Width: 2.007" (50.98mm)
- Diameter: -
- Fin Height: 1.614" (41.00mm)
- Power Dissipation @ Temperature Rise: 9.8W @ 75°C
- Thermal Resistance @ Forced Air Flow: 2.01°C/W @ 200 LFM
- Thermal Resistance @ Natural: 7.65°C/W
- Material: Aluminum
- Material Finish: Black Anodized