HSS-B20-NP-02
CUI Devices
HSS-B20-NP-02
CUI Devices
HEATSINK TO-220 3.6W ALUMINUM
Reference Price (USD)
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$0.35582
500+
$0.3522618
1000+
$0.3487036
1500+
$0.3451454
2000+
$0.3415872
2500+
$0.338029
Exquisite packaging
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HSS-B20-NP-02
$0.36
Product details
The HSS-B20-NP-02 by CUI Devices delivers military-grade reliability in the Thermal - Heat Sinks category for satellite communications. This space-qualified thermal solution combines exceptional performance with the ruggedness required for orbital and terrestrial extreme environments.The Dual-Phase Heat Pipe design maintains thermal resistance within 5% variance in zero-g conditions. Unlike conventional solutions, this configuration operates effectively at any orientation with respect to gravity.Engineered for GaN RF power amplifiers, the solution handles {Power Dissipation @ Temperature Rise} in vacuum conditions. The thermal interface maintains stable performance across 500+ thermal cycles from -150 C to +125 C.Spiral Fin configuration delivers {Thermal Resistance @ Natural} in omnidirectional radiation environments. The geometry maximizes surface area while minimizing molecular contamination risk.The 0.748" (19.00mm) dimension complies with CubeSat form factors while providing sufficient heat rejection capability. The design withstands launch vibration levels up to 20g RMS.With 0.830" (21.08mm) coverage, the solution accommodates multiple heat sources in constrained spacecraft volumes. Thermal analysis shows less than 5 C gradient across the entire structure.Optimized 0.394" (10.00mm) ensures effective radiation cooling in vacuum conditions. The black anodized surface maintains emissivity >0.95 after prolonged UV exposure.Rated for 3.6W @ 75°C in orbital conditions, the design includes margin for eclipse operation cycles. Thermal models account for albedo and Earth IR radiation effects.The 5.39°C/W @ 200 LFM performance is qualified for terrestrial use in desert environments. The design prevents sand ingress while maintaining cooling performance.The 20.59°C/W specification enables passive thermal control in spacecraft applications. The design maintains components within operational limits using only radiation cooling.Aluminum 6061-T6 with Type III hard anodize meets MIL-A-8625 requirements. The material outgassing characteristics comply with NASA ASTM E595 standards.Black Anodized surface treatment provides optimal emissivity (0.92) for radiative cooling. The finish withstands atomic oxygen exposure in LEO environments.
Product Attributes
- Product Status: Active
- Type: Board Level
- Package Cooled: TO-220
- Attachment Method: -
- Shape: Rectangular, Fins
- Length: 0.748" (19.00mm)
- Width: 0.830" (21.08mm)
- Diameter: -
- Fin Height: 0.394" (10.00mm)
- Power Dissipation @ Temperature Rise: 3.6W @ 75°C
- Thermal Resistance @ Forced Air Flow: 5.39°C/W @ 200 LFM
- Thermal Resistance @ Natural: 20.59°C/W
- Material: Aluminum
- Material Finish: Black Anodized
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