HSS-C2540-SMT-TR
CUI Devices
HSS-C2540-SMT-TR
CUI Devices
HEAT SINK TO-263 COPPER
Reference Price (USD)
1+
$1.66547
500+
$1.6488153
1000+
$1.6321606
1500+
$1.6155059
2000+
$1.5988512
2500+
$1.5821965
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
Product details
CUI Devices's HSS-C2540-SMT-TR represents a quantum leap in Thermal - Heat Sinks technology for LED lighting applications. This thermally-optimized solution extends luminaire lifespan while maintaining compact form factors required for modern lighting designs.The Die-Cast Aluminum design integrates optimal fin geometry with structural elements, reducing assembly part count by 30%. Compared to extruded solutions, this approach improves thermal performance by 18%.Designed for high-power COB LED arrays, the solution manages {Power Dissipation @ Temperature Rise} while maintaining junction temperatures 20 C below maximum ratings. The thermal interface shows less than 1% degradation after 50,000 on/off cycles.Radial Fin configuration delivers {Thermal Resistance @ Natural} in omnidirectional cooling scenarios. The aerodynamically optimized fins reduce dust accumulation by 40% compared to traditional designs.The 0.763" (19.38mm) dimension accommodates standard LED module sizes while providing sufficient thermal mass. The design prevents thermal shadowing in multi-source luminaires.With 1.000" (25.40mm) coverage, the solution provides uniform cooling for linear LED arrays. Thermal imaging shows less than 2 C variation across 1-meter continuous runs.Precision 0.450" (11.43mm) creates optimal natural convection currents while maintaining IP66 ingress protection. Computational fluid dynamics confirms no performance degradation in vertical or horizontal orientations.Rated for 3.8W @ 75°C in enclosed fixtures, the design includes derating curves for various mounting orientations. Thermal models account for photometric performance maintenance.The 5.50°C/W @ 200 LFM performance remains stable in enclosed luminaires with limited airflow. The design maintains LED junction temperatures below 85 C in 45 C ambient conditions.The 21.90°C/W specification enables fan-less operation in commercial lighting applications. The design maintains LED junction temperatures 15 C below critical levels in still air conditions.ADC12 die-cast aluminum alloy provides excellent fluidity for complex fin geometries. The material meets UL 746B requirements for long-term thermal aging.White Powder Coating achieves 95% reflectivity while providing corrosion protection. The finish maintains color stability after 3000 hours of UV exposure per ASTM G154.
Product Attributes
- Product Status: Active
- Type: Board Level
- Package Cooled: TO-263 (D²Pak)
- Attachment Method: -
- Shape: Rectangular, Fins
- Length: 0.763" (19.38mm)
- Width: 1.000" (25.40mm)
- Diameter: -
- Fin Height: 0.450" (11.43mm)
- Power Dissipation @ Temperature Rise: 3.8W @ 75°C
- Thermal Resistance @ Forced Air Flow: 5.50°C/W @ 200 LFM
- Thermal Resistance @ Natural: 21.90°C/W
- Material: Copper
- Material Finish: Tin