HSS05-C20-SMT-TR
CUI Devices
HSS05-C20-SMT-TR
CUI Devices
HEAT SINK, STAMPING, TO-220, 12.
Reference Price (USD)
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$0.98000
500+
$0.9702
1000+
$0.9604
1500+
$0.9506
2000+
$0.9408
2500+
$0.931
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HSS05-C20-SMT-TR
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Product details
The HSS05-C20-SMT-TR by CUI Devices delivers military-grade reliability in the Thermal - Heat Sinks category for satellite communications. This space-qualified thermal solution combines exceptional performance with the ruggedness required for orbital and terrestrial extreme environments.The Dual-Phase Heat Pipe design maintains thermal resistance within 5% variance in zero-g conditions. Unlike conventional solutions, this configuration operates effectively at any orientation with respect to gravity.Engineered for GaN RF power amplifiers, the solution handles {Power Dissipation @ Temperature Rise} in vacuum conditions. The thermal interface maintains stable performance across 500+ thermal cycles from -150 C to +125 C.Spiral Fin configuration delivers {Thermal Resistance @ Natural} in omnidirectional radiation environments. The geometry maximizes surface area while minimizing molecular contamination risk.The 1.031" (26.20mm) dimension complies with CubeSat form factors while providing sufficient heat rejection capability. The design withstands launch vibration levels up to 20g RMS.With 0.500" (12.70mm) coverage, the solution accommodates multiple heat sources in constrained spacecraft volumes. Thermal analysis shows less than 5 C gradient across the entire structure.Optimized 0.390" (9.91mm) ensures effective radiation cooling in vacuum conditions. The black anodized surface maintains emissivity >0.95 after prolonged UV exposure.Rated for 2.3W @ 75°C in orbital conditions, the design includes margin for eclipse operation cycles. Thermal models account for albedo and Earth IR radiation effects.The 14.00°C/W @ 200 LFM performance is qualified for terrestrial use in desert environments. The design prevents sand ingress while maintaining cooling performance.The 32.69°C/W specification enables passive thermal control in spacecraft applications. The design maintains components within operational limits using only radiation cooling.Aluminum 6061-T6 with Type III hard anodize meets MIL-A-8625 requirements. The material outgassing characteristics comply with NASA ASTM E595 standards.Black Anodized surface treatment provides optimal emissivity (0.92) for radiative cooling. The finish withstands atomic oxygen exposure in LEO environments.
Product Attributes
- Product Status: Active
- Type: Board Level, Vertical
- Package Cooled: TO-220
- Attachment Method: -
- Shape: Rectangular
- Length: 1.031" (26.20mm)
- Width: 0.500" (12.70mm)
- Diameter: -
- Fin Height: 0.390" (9.91mm)
- Power Dissipation @ Temperature Rise: 2.3W @ 75°C
- Thermal Resistance @ Forced Air Flow: 14.00°C/W @ 200 LFM
- Thermal Resistance @ Natural: 32.69°C/W
- Material: Copper Alloy
- Material Finish: Tin
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