HSS14-B20-NP
CUI Devices
HSS14-B20-NP
CUI Devices
HEAT SINK, STAMPING, TO-220, 19.
Reference Price (USD)
1+
$0.54015
500+
$0.5347485
1000+
$0.529347
1500+
$0.5239455
2000+
$0.518544
2500+
$0.5131425
Exquisite packaging
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HSS14-B20-NP
$0.54
Product details
CUI Devices's HSS14-B20-NP offers military-grade thermal solutions in the Thermal - Heat Sinks segment, specifically developed for aerospace and defense applications. This ruggedized design exceeds stringent military specifications while delivering exceptional thermal performance in extreme environments.The Board Level Vertical Extrusion configuration withstands 15g vibration per MIL-STD-810H. Unlike commercial designs, this variant maintains thermal contact under combined thermal and mechanical stress.Engineered for power modules in radar and avionics systems, the solution manages {Power Dissipation @ Temperature Rise} at 50,000ft altitude. The thermal interface maintains performance across -55 C to +125 C operational range.Angled Fins configuration delivers {Thermal Resistance @ Forced Air Flow} in reverse airflow conditions common in aircraft. The aerodynamic profile reduces pressure drop by 18% compared to straight fins.The 0.980" (24.89mm) dimension complies with ARINC 600 rack standards for avionics. The design includes provisions for conductive cooling to cold plates in liquid-cooled systems.With 0.750" (19.05mm) coverage, the solution meets SWaP-C constraints in military electronics. The lightweight construction reduces overall system weight by up to 30% compared to traditional designs.Optimized 0.157" (4.00mm) ensures performance in thin-atmosphere conditions. The fin geometry is validated through computational fluid dynamics at 0.2atm pressure.Rated for 3.1W @ 75°C in 71 C ambient conditions, the design includes margin for solar loading in desert operations. Thermal models account for radiative heat transfer in space applications.The 11.60°C/W @ 200 LFM is qualified under MIL-STD-810G sand/dust conditions. The design prevents performance degradation despite particulate exposure.The 23.91°C/W specification enables operation during cooling system failures. The design maintains critical components below 100 C in zero-airflow conditions for 60 minutes.AavSHIELD 3C coated Aluminum provides EMI/RFI shielding exceeding MIL-STD-461G requirements. The material maintains thermal performance after salt fog exposure per MIL-STD-810G.Tin-plated finish ensures solderability after long-term storage per MIL-STD-2073-1. The surface treatment provides corrosion protection in naval environments.
Product Attributes
- Product Status: Active
- Type: Board Level, Vertical
- Package Cooled: TO-220
- Attachment Method: -
- Shape: Rectangular
- Length: 0.980" (24.89mm)
- Width: 0.750" (19.05mm)
- Diameter: -
- Fin Height: 0.157" (4.00mm)
- Power Dissipation @ Temperature Rise: 3.1W @ 75°C
- Thermal Resistance @ Forced Air Flow: 11.60°C/W @ 200 LFM
- Thermal Resistance @ Natural: 23.91°C/W
- Material: Aluminum Alloy
- Material Finish: Black Anodized
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