HSS23-B20-NP

The HSS23-B20-NP from CUI Devices delivers precision thermal management for medical devices in the Thermal - Heat Sinks category. Designed for reliability in life-critical applications, this solution combines biocompatible materials with exceptional thermal performance for imaging and diagnostic equipment.The Board Level Extrusion design provides EMI shielding compatibility crucial for sensitive medical electronics. The integrated grounding features reduce RF interference by 25dB compared to standard designs.Specialized for CPU and ASIC cooling in medical imaging systems, the solution handles {Power Dissipation @ Temperature Rise} with minimal acoustic signature. The thermal interface maintains stability through repeated sterilization cycles.Medical-grade Thermal Tape allows non-conductive attachment meeting IEC 60601-1 leakage current requirements. The adhesive maintains bond strength after 100+ autoclave cycles at 134 C.Rectangular Fins configuration achieves {Thermal Resistance @ Forced Air Flow} in laminar airflow environments. The streamlined design prevents particulate accumulation per ISO 14644 Class 5 cleanroom standards.The 1.654" (42.00mm) dimension fits standard medical cart footprints while providing sufficient thermal mass for pulsed power loads. The design minimizes eddy currents in MRI environments.With 1.496" (38.00mm) coverage, the solution cools multi-channel sensor arrays without thermal crosstalk. Infrared thermography shows less than 1 C variation across critical components.Precision 0.787" (20.00mm) ensures compatibility with medical device airflow restrictions (typically <0.5m/s). The fin density is optimized for silent operation (<20dB) in patient care environments.Rated for 7.36W @ 75°C in 40 C ambient conditions, the design includes derating curves for altitude operation up to 3000m. The thermal performance is validated per IEC 60601-1 thermal requirements.The 5.00°C/W @ 200 LFM performance is validated under the intermittent operation profiles typical of medical equipment. The design maintains stable performance during 10% duty cycle bursts.The 10.19°C/W specification enables convection cooling in sealed medical enclosures. The design maintains safe surface temperatures (<41 C) for patient-contact applications.Medical-grade Aluminum (EN AW-1350) with 99.5% purity ensures biocompatibility. The material is certified per ISO 10993-5 for cytotoxicity and ISO 10993-10 for irritation sensitivity.Green Anodized finish provides visual differentiation for medical device BOM control. The surface treatment is resistant to isopropyl alcohol and hydrogen peroxide disinfectants.