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HSS26-B20-P38

CUI Devices
HSS26-B20-P38 Preview
HSS26-B20-P38
CUI Devices
HEAT SINK, STAMPING, TO-218/TO-2
Reference Price (USD)
1+
$0.83000
500+
$0.8217
1000+
$0.8134
1500+
$0.8051
2000+
$0.7968
2500+
$0.7885
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
HSS26-B20-P38

HSS26-B20-P38

$0.83

Product details

Product Attributes

  • Product Status: Active
  • Type: Board Level, Vertical
  • Package Cooled: TO-218, TO-220
  • Attachment Method: Bolt On and PC Pin
  • Shape: Rectangular, Fins
  • Length: 2.000" (50.80mm)
  • Width: 1.378" (35.00mm)
  • Diameter: -
  • Fin Height: 0.335" (8.50mm)
  • Power Dissipation @ Temperature Rise: 4.5W @ 75°C
  • Thermal Resistance @ Forced Air Flow: 9.20°C/W @ 200 LFM
  • Thermal Resistance @ Natural: 16.66°C/W
  • Material: Aluminum Alloy
  • Material Finish: Black Anodized

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Wakefield-Vette

127693

1.66" WIDE X 12" BGA HEATSINK EX

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