IA18XERPLQ100IR2

Analog Devices Inc.

General info

Part Number

IA18XERPLQ100IR2

Manufacturer

Analog Devices Inc.

Description:

IC MCU 8/16BIT ROMLESS 100LQFP

Datasheet:

IA18XERPLQ100IR2 PDF IA18XERPLQ100IR2 Datasheet

Reference Price (USD)

$43.57178

500+

$43.1360622

1000+

$42.7003444

1500+

$42.2646266

2000+

$41.8289088

2500+

$41.393191

Exquisite packaging

Discount

TT / Paypal / Credit Card / Western Union / Money Gram

IA18XERPLQ100IR2

$43.57

Product details

Designed for industrial IoT applications, the IA18XERPLQ100IR2 by Analog Devices Inc. redefines performance in Embedded - Microcontrollers. Its ultra-low power architecture and robust RF coexistence capabilities make it ideal for wireless sensor networks in smart factory environments.A 8/16-Bit architecture with single-cycle multiply-accumulate units accelerates FFT computations for vibration analysis in predictive maintenance applications.Operating at 50MHz with <1 A/MHz active current, the microcontroller delivers the perfect balance between performance and energy efficiency for energy-harvesting applications.The EBI/EMI, UART/USART interfaces incorporate galvanic isolation support, enabling direct connection to industrial fieldbus networks without external isolation components.DMA, POR, WDT include advanced security features like cryptographic accelerators and true random number generators, protecting industrial equipment from cyber threats.With 32 programmable as either digital or analog interfaces, the device can directly interface with diverse industrial sensors including 4-20mA loops.The ROMless implementation supports live firmware updates with rollback protection, ensuring uninterrupted operation during field upgrades.32K x 8 of retention RAM maintains context during deep sleep modes, enabling instant wake-up response to critical process events.The 3V ~ 3.6V range supports direct powering from industrial 24V DC supplies through simple resistive dividers, simplifying power architecture.The Internal design maintains 0.25% frequency accuracy for wireless protocol timing, eliminating the need for external crystal components in space-constrained designs.Rated for -40°C ~ 85°C (TA), the device operates reliably in foundry environments where ambient temperatures can fluctuate rapidly.Surface Mount packaging withstands repeated thermal shock from -40 C to 125 C, meeting reliability requirements for outdoor industrial installations.The 100-LQFP format provides 8kV ESD protection on all pins, surviving electrostatic discharges common in plastic injection molding facilities.Available in 100-LQFP (14x14), the microcontroller supports industrial-grade qualification including 1000-hour HTOL testing at 125 C.