ICF-316-T-O-TR
Samtec Inc.
ICF-316-T-O-TR
Samtec Inc.
CONN IC DIP SOCKET 16POS TIN
Reference Price (USD)
1+
$2.83000
500+
$2.8017
1000+
$2.7734
1500+
$2.7451
2000+
$2.7168
2500+
$2.6885
Exquisite packaging
Discount
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ICF-316-T-O-TR
$2.83
Product details
Samtec Inc.'s ICF-316-T-O-TR represents the next generation of Sockets for ICs, Transistors solutions, optimized for industrial IoT applications. The innovative design incorporates multiple reliability enhancements while maintaining backward compatibility with legacy systems.The DIP, 0.3" (7.62mm) Row Spacing architecture provides unparalleled flexibility for prototype development. System designers can leverage multiple configuration options to optimize signal paths in mixed-signal circuits.Configured with 16 (2 x 8), this socket supports complex ASIC programming. The symmetrical pin distribution minimizes propagation delay variations in high-speed memory interfaces.Precision-engineered 0.100" (2.54mm) spacing prevents solder bridging during reflow. This feature is particularly valuable for miniaturized medical device manufacturing.Tin surface treatment delivers exceptional wear resistance. Accelerated aging tests show <5% contact resistance change after 1,000 thermal cycles.Beryllium Copper contact material provides optimal stress relaxation properties. Finite element analysis confirms consistent normal force throughout the product lifecycle.The Surface Mount design facilitates rapid field replacement in harsh environments. This feature reduces maintenance downtime in offshore wind turbine applications.Incorporating Open Frame, the socket prevents particulate contamination in cleanroom settings. The unique geometry meets ISO Class 5 particulate standards.Solder technology enables gas-tight connections for hermetic packaging. This is essential for aerospace avionics operating at altitude.The 0.100" (2.54mm) post arrangement supports high-current applications. Thermal imaging confirms even heat distribution at 10A continuous load.Tin plating prevents intermetallic growth in high-temperature environments. This extends service life in downhole drilling equipment.Using Beryllium Copper for posts ensures compatibility with press-fit assembly. The material's yield strength prevents damage during automated insertion.Liquid Crystal Polymer (LCP) construction provides UV resistance for outdoor applications. The material retains 95% of tensile strength after 5,000 hours of UV exposure.With -55°C ~ 125°C range, the socket operates flawlessly in steel mill controls. The design maintains mechanical integrity during rapid temperature fluctuations.
Product Attributes
- Product Status: Active
- Type: DIP, 0.3" (7.62mm) Row Spacing
- Number of Positions or Pins (Grid): 16 (2 x 8)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Tin
- Contact Finish Thickness - Mating: -
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Surface Mount
- Features: Open Frame
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Tin
- Contact Finish Thickness - Post: -
- Contact Material - Post: Beryllium Copper
- Housing Material: Liquid Crystal Polymer (LCP)
- Operating Temperature: -55°C ~ 125°C
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