K32L2B11VMP0A
NXP USA Inc.
Product details
NXP USA Inc.'s K32L2B11VMP0A sets new benchmarks in Embedded - Microcontrollers performance, optimized for next-generation automotive electronics. Its radiation-hardened design and exceptional EMI immunity make it the preferred choice for safety-critical vehicle control systems.The ARM® Cortex®-M0+ core architecture incorporates dual instruction pipelines that deliver 1.5 DMIPS/MHz, significantly enhancing computational throughput for autonomous driving algorithms.A 32-Bit Single-Core processing width enables single-cycle execution of complex DSP operations, reducing latency in active noise cancellation systems for premium automotive audio.When clocked at 48MHz, the microcontroller achieves 32-bit floating point operations in just 3 cycles, enabling real-time processing of LiDAR point clouds for ADAS applications.With FlexIO, I²C, SPI, TSI, UART/USART, USB protocol support, the device forms the backbone of in-vehicle networks, providing deterministic communication between ECUs with <100ns synchronization accuracy.The comprehensive DMA, LCD, PWM, WDT suite includes automotive-specific features like crank-angle measurement interfaces and injector drive timers, reducing external component count in engine management systems.64KB (64K x 8) of fault-tolerant storage accommodates ASIL-D compliant software architectures with dual-core lockstep implementation for functional safety.The FLASH implementation features ECC protection with single-bit correction capability, ensuring code integrity in high-vibration environments.32K x 8 of parity-protected memory prevents data corruption from alpha particle strikes, meeting ISO 26262 requirements for safety-critical storage.An automotive-grade 1.2V range maintains operation during load dump events up to 40V, protecting against voltage transients common in 12V vehicle systems.Internal clocking architecture maintains <50ppm frequency stability across the entire automotive temperature range, ensuring reliable CAN bus timing.The Surface Mount option provides superior solder joint reliability for PCB assemblies subjected to thermal cycling in underhood locations.64-LFBGA packaging incorporates copper heat spreaders that reduce junction temperatures by 15 C compared to standard packages in confined spaces.Available in 64-MAPBGA (5x5), the microcontroller supports AEC-Q100 Grade 1 qualification for deployment in safety-relevant automotive systems.
Product Attributes
- Product Status: Active
- Core Processor: ARM® Cortex®-M0+
- Core Size: 32-Bit Single-Core
- Speed: 48MHz
- Connectivity: FlexIO, I²C, SPI, TSI, UART/USART, USB
- Peripherals: DMA, LCD, PWM, WDT
- Number of I/O: -
- Program Memory Size: 64KB (64K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 32K x 8
- Voltage - Supply (Vcc/Vdd): 1.2V
- Data Converters: -
- Oscillator Type: Internal
- Operating Temperature: -
- Mounting Type: Surface Mount
- Package / Case: 64-LFBGA
- Supplier Device Package: 64-MAPBGA (5x5)