L138-FI-236-RC

Engineered for next-generation automotive electronics, the L138-FI-236-RC by Critical Link LLC redefines performance in the Embedded - Microcontroller, Microprocessor, FPGA Modules category. Its combination of functional safety features and high-speed processing makes it ideal for ADAS and autonomous vehicle perception systems.The MPU, DSP, FPGA Core architecture provides automotive-grade reliability with its dual-core lockstep configuration. This fail-operational design exceeds ISO 26262 ASIL-D requirements for safety-critical vehicle systems.The ARM926EJ-S, OMAP-L138 delivers automotive-qualified performance with its temperature-compensated clock generation. Its superscalar architecture efficiently processes multiple sensor fusion algorithms simultaneously for comprehensive environment modeling.With the TMS320C674x (DSP), Spartan-6, XC6SLX45 (FPGA) handling dedicated neural network acceleration, the module achieves unprecedented object detection speeds. This hardware acceleration is crucial for meeting the low-latency demands of autonomous emergency braking systems.Operating at 456MHz, the processor meets the real-time requirements of vehicle bus networks. The clock distribution network features automotive-grade jitter attenuation for reliable CAN FD and Automotive Ethernet communication.The 512MB (NAND), 8MB (NOR) flash memory supports over-the-air update capabilities with robust rollback protection. This secure storage solution is essential for complying with automotive cybersecurity standards like WP.29.8kB (Internal), 256MB (External) of error-correcting RAM ensures fault-tolerant operation of safety monitors. The memory subsystem's parity checking provides additional protection against single-event upsets in radiation-prone environments.The automotive-grade SO-DIMM-200 interface meets USCAR vibration specifications. Its sealed design prevents moisture ingress in under-hood applications while maintaining signal integrity at high speeds.With dimensions of 2.66" x 2" (67.6mm x 50.8mm), the module fits within stringent automotive form factor requirements. The package's thermal design maintains performance during extended high-temperature operation in engine compartments.Qualified for -40°C ~ 70°C, the solution withstands the thermal extremes of electric vehicle power electronics. Extensive reliability testing ensures operation throughout the vehicle's lifespan.