L777HRA26P
Amphenol ICC (Commercial Products)
L777HRA26P
Amphenol ICC (Commercial Products)
CONN D-SUB HD HOUSING PLUG 26POS
Reference Price (USD)
1+
$2.41000
500+
$2.3859
1000+
$2.3618
1500+
$2.3377
2000+
$2.3136
2500+
$2.2895
Exquisite packaging
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L777HRA26P
$2.41
Product details
The L777HRA26P from Amphenol ICC (Commercial Products) establishes new benchmarks in D-Sub, D-Shaped Connectors - Housings for 5G infrastructure, engineered to support millimeter-wave frequencies with minimal insertion loss. This high-performance D-Sub solution enables reliable base station interconnects while withstanding extreme environmental conditions.Implementing D-Sub, High Density architecture, the connector achieves 70% reduction in signal reflection compared to conventional designs at 28GHz frequencies.The Plug for Male Contacts configuration features impedance-controlled contacts that maintain <1.5:1 VSWR up to 40GHz, critical for 5G massive MIMO applications.With 26 available channels, the design supports 64T64R antenna arrays while providing separate power and control lines in single compact interface.Optimized 3 row spacing prevents mutual coupling between adjacent RF paths, maintaining >30dB isolation at 6GHz bandwidth.The 2 (DA, A) High Density incorporates waveguide-like shielding that reduces surface wave propagation by 18dB compared to standard D-Sub designs.Special Signal terminals employ air-dielectric insulation that minimizes dielectric loss (tan <0.001) at millimeter-wave frequencies.Designed for Free Hanging (In-Line) installation, the connector features precision alignment guides that ensure <0.05mm positional accuracy for consistent RF performance.The Housing/Shell (Unthreaded) includes integrated O-ring seals that maintain weatherproof integrity through 500 thermal cycles (-40 C to +85 C) with <1% compression set.Incorporating Grounding Indents, the design implements anti-walk threaded coupling that prevents loosening under vibration (10-2000Hz, 15Grms random vibration).Utilizing Steel, Tin Plated, the housing provides exceptional passive intermodulation (PIM) performance <-160dBc at 2x43dBm tones.Precision 100µin (2.54µm) plating ensures stable contact resistance (<3m variation) despite thermal cycling and environmental exposure.
Product Attributes
- Product Status: Active
- Connector Style: D-Sub, High Density
- Connector Type: Plug for Male Contacts
- Number of Positions: 26
- Number of Rows: 3
- Shell Size, Connector Layout: 2 (DA, A) High Density
- Contact Type: Signal
- Mounting Type: Free Hanging (In-Line)
- Flange Feature: Housing/Shell (Unthreaded)
- Features: Grounding Indents
- Primary Material: -
- Shell Material, Finish: Steel, Tin Plated
- Shell Finish Thickness: 100µin (2.54µm)
- Ingress Protection: -
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