LFSC3GA15E-5FN900I
Lattice Semiconductor Corporation
LFSC3GA15E-5FN900I
Lattice Semiconductor Corporation
IC FPGA 300 I/O 900FBGA
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Product details
The LFSC3GA15E-5FN900I from Lattice Semiconductor Corporation delivers military-grade reliability in Embedded - FPGAs (Field Programmable Gate Array), developed for aerospace and defense applications. This radiation-tolerant FPGA combines high-speed processing with configurable security features, making it ideal for secure communications and electronic warfare systems. The architecture includes tamper-resistant design elements while maintaining full observability for system diagnostics.Organized into 3750 radiation-hardened logic blocks, the architecture supports triple modular redundancy designs. Each CLB includes voting logic for single-event transient mitigation in space applications.With 15000 radiation-hardened logic cells, the device implements complex encryption algorithms with deterministic latency. The cell architecture includes single-event upset mitigation techniques without compromising routing flexibility.The 1054720 bits of secure memory incorporate physical unclonable functions for device authentication. The memory subsystem implements parity protection with real-time error logging for system health monitoring.The 300 military-spec I/Os include EMP hardening and support differential signaling up to 12.5Gbps. Each I/O bank can be configured for TEMPEST-compliant emissions control in sensitive intelligence applications.Operating from 0.95V ~ 1.26V, the power delivery network includes redundant regulators for fault tolerance. The adaptive voltage scaling maintains optimal performance while minimizing thermal signatures in covert deployments.The Surface Mount package meets MIL-STD-883 shock and vibration requirements while providing excellent thermal conduction. The hermetic sealing prevents moisture ingress in high-altitude or maritime environments.Qualified for -40°C ~ 105°C (TJ) operation, the device maintains full functionality across extreme environmental conditions. The thermal management system prevents performance throttling during sustained high-compute workloads.The 900-BBGA package implements gold-plated contacts for corrosion resistance in harsh environments. The ceramic substrate provides excellent alpha particle shielding for space applications.Supplied in 900-FPBGA (31x31) configuration, the device includes full traceability documentation required for defense contracts. The packaging meets ESD protection standards for sensitive military components.
Product Attributes
- Product Status: Obsolete
- Number of LABs/CLBs: 3750
- Number of Logic Elements/Cells: 15000
- Total RAM Bits: 1054720
- Number of I/O: 300
- Number of Gates: -
- Voltage - Supply: 0.95V ~ 1.26V
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 105°C (TJ)
- Package / Case: 900-BBGA
- Supplier Device Package: 900-FPBGA (31x31)