LM9704SL
Texas Instruments
LM9704SL
Texas Instruments
IC DGTL IMAGEPROC 128LAMINATECSP
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Product details
Texas Instruments's LM9704SL reimagines Embedded - Microcontrollers - Application Specific for smart grid and power conversion applications. This application-specific microcontroller integrates advanced PWM generation with high-resolution ADC capabilities, enabling precise control of power electronics.Optimized for Digital Imaging implementations, the device features hardware-based overcurrent protection with 50ns response time. The integrated sigma-delta modulators enable direct sensorless motor control.The CR16C core includes dedicated trigonometric acceleration units. The parallel execution pipelines achieve 95% duty cycle accuracy at 100kHz switching frequencies.Supporting External Program Memory options, the flash memory incorporates shadow registers for bumpless firmware updates. The dual-plane architecture allows live updates during continuous operation.The 32K x 8 memory implements deterministic access timing for control loops. The dual-port architecture allows simultaneous access from CPU and PWM units.With ACCESS.bus, Microwire/SPI, USART, USB connectivity, the device supports EtherCAT POWERLINK protocols. Each communication peripheral includes reinforced isolation meeting IEC 61800-5-1 standards.The 16 configurable ports feature 12-bit DAC outputs for analog control. Programmable dead-time insertion prevents shoot-through in bridge configurations.Operating from 2.25V ~ 2.75V inputs, the power architecture withstands 100V transients. The integrated gate drivers support SiC and GaN power devices.Certified for -10°C ~ 85°C operation, the package uses direct-bonded copper substrates. Thermal impedance is minimized for high-current applications.The Surface Mount option supports press-fit assembly for high-power PCBs. The package design accommodates thick copper layers for heat dissipation.Available in 128-TFQFN, CSP Dual Rows, Thermal Pads format, the package includes Kelvin sense connections. The low-inductance design minimizes switching losses at high di/dt rates.Supplied in 128-TECSP (10x10) configuration, each unit includes power cycling test reports. Production testing includes 100% burn-in at maximum junction temperature.
Product Attributes
- Product Status: Obsolete
- Applications: Digital Imaging
- Core Processor: CR16C
- Program Memory Type: External Program Memory
- Controller Series: -
- RAM Size: 32K x 8
- Interface: ACCESS.bus, Microwire/SPI, USART, USB
- Number of I/O: 16
- Voltage - Supply: 2.25V ~ 2.75V
- Operating Temperature: -10°C ~ 85°C
- Mounting Type: Surface Mount
- Package / Case: 128-TFQFN, CSP Dual Rows, Thermal Pads
- Supplier Device Package: 128-TECSP (10x10)
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