LPC18S50FET180551
NXP USA Inc.
LPC18S50FET180551
NXP USA Inc.
IC MCU 32BIT ROMLESS 180TFBGA
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Product details
NXP USA Inc.'s LPC18S50FET180551 delivers military-grade reliability in Embedded - Microcontrollers, developed for aerospace and defense applications where radiation tolerance and mission longevity are paramount.The ARM® Cortex®-M3 core incorporates triple modular redundancy for SEU mitigation, achieving >99% single-event upset immunity in orbital radiation environments.A 32-Bit Single-Core architecture with parity-protected data paths prevents silent data corruption, meeting MIL-STD-883G requirements for spaceborne electronics.When operating at 180MHz, the microcontroller maintains timing accuracy within 0.01% despite temperature variations from -55 C to 125 C, critical for navigation systems.The CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, QEI, MMC/SD, SPI, SSI, SSP, UART/USART, USB interfaces implement Manchester encoding for noise-immune data transmission, ensuring reliable communication in high-EMI environments like radar installations.Brown-out Detect/Reset, DMA, I²S, LCD, POR, PWM, WDT include radiation-hardened timers and watchdog circuits that automatically recover from single-event functional interrupts within 10 s.With 118 MIL-STD-1553-compatible interfaces, the device can serve as a remote terminal in distributed avionics architectures without external transceivers.The ROMless implementation uses SONOS technology that withstands 300krad total ionizing dose, exceeding space qualification requirements.200K x 8 of scrubable memory prevents accumulation of single-event upsets, maintaining data integrity during extended missions in high-radiation orbits.The 2.2V ~ 3.6V range supports operation from unregulated spacecraft power buses with 100mV ripple, eliminating need for additional regulation stages.Precision A/D 8x10b; D/A 1x10b maintain 12-bit accuracy during solar flare events, providing reliable telemetry data even during peak radiation periods.The Internal clock source incorporates automatic frequency compensation that maintains <1ppm/ C drift across the military temperature range.Qualified for -40°C ~ 85°C (TA), the device operates reliably in exoatmospheric conditions where thermal cycling extremes exceed commercial specifications.Surface Mount packaging uses AuSn die attach for superior thermal conductivity in vacuum environments, preventing die delamination during thermal transients.The 180-TFBGA format provides hermetic sealing against moisture ingress, meeting MIL-PRF-38534 Class K requirements for high-reliability applications.Available in 180-TFBGA (12x12), the microcontroller undergoes rigorous screening including burn-in and 100% electrical testing at temperature extremes.
Product Attributes
- Product Status: Active
- Core Processor: ARM® Cortex®-M3
- Core Size: 32-Bit Single-Core
- Speed: 180MHz
- Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, QEI, MMC/SD, SPI, SSI, SSP, UART/USART, USB
- Peripherals: Brown-out Detect/Reset, DMA, I²S, LCD, POR, PWM, WDT
- Number of I/O: 118
- Program Memory Size: -
- Program Memory Type: ROMless
- EEPROM Size: -
- RAM Size: 200K x 8
- Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
- Data Converters: A/D 8x10b; D/A 1x10b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 180-TFBGA
- Supplier Device Package: 180-TFBGA (12x12)
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