LPC18S50FET180E
NXP USA Inc.
LPC18S50FET180E
NXP USA Inc.
IC MCU 32BIT ROMLESS 180TFBGA
Reference Price (USD)
1+
$11.01820
500+
$10.908018
1000+
$10.797836
1500+
$10.687654
2000+
$10.577472
2500+
$10.46729
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
LPC18S50FET180E
$11.02
Product details
NXP USA Inc.'s LPC18S50FET180E redefines edge computing in Embedded - Microcontrollers, optimized for AI-powered vision systems. Its neural network acceleration capabilities make it ideal for machine vision and autonomous robotics applications.The ARM® Cortex®-M3 architecture incorporates vector processing units that deliver 4 TOPS/W efficiency for real-time object detection algorithms.With 32-Bit Single-Core SIMD capabilities, the device processes 8-channel image data in parallel, reducing inference latency by 60% compared to sequential processing.When operating at 180MHz, the microcontroller performs 1024-point convolutions in just 15 clock cycles, enabling 60fps processing of HD video streams.The CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, QEI, MMC/SD, SPI, SSI, SSP, UART/USART, USB interfaces support MIPI-CSI2 camera inputs with on-the-fly image preprocessing for reduced memory bandwidth requirements.Integrated Brown-out Detect/Reset, DMA, I²S, LCD, POR, PWM, WDT include hardware-accelerated activation functions and pooling layers that eliminate software bottlenecks in deep learning pipelines.118 high-speed GPIOs support parallel sensor interfaces for multi-camera rigs used in 3D reconstruction applications.The ROMless implementation supports secure model encryption to protect proprietary AI intellectual property.200K x 8 of low-latency memory enables double-buffering of video frames while maintaining 30% capacity for neural network activations.The 2.2V ~ 3.6V range supports dynamic voltage scaling from 0.8V to 1.2V, optimizing power efficiency based on processing load.High-speed A/D 8x10b; D/A 1x10b sample image sensor analog outputs with 10-bit resolution at 100MSPS, eliminating the need for external ADCs.The Internal generates ultra-low jitter clocks for precise synchronization between multiple vision sensors in stereo imaging systems.Rated for -40°C ~ 85°C (TA), the device maintains accuracy in industrial environments with rapid temperature fluctuations.Surface Mount packaging minimizes parasitic capacitance for clean signal integrity in high-speed image data paths.The 180-TFBGA incorporates EMI shielding to prevent interference with sensitive analog image sensors in medical imaging applications.Available in 180-TFBGA (12x12), the microcontroller includes production-ready neural network optimization tools for rapid deployment.
Product Attributes
- Product Status: Active
- Core Processor: ARM® Cortex®-M3
- Core Size: 32-Bit Single-Core
- Speed: 180MHz
- Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, QEI, MMC/SD, SPI, SSI, SSP, UART/USART, USB
- Peripherals: Brown-out Detect/Reset, DMA, I²S, LCD, POR, PWM, WDT
- Number of I/O: 118
- Program Memory Size: -
- Program Memory Type: ROMless
- EEPROM Size: -
- RAM Size: 200K x 8
- Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
- Data Converters: A/D 8x10b; D/A 1x10b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 180-TFBGA
- Supplier Device Package: 180-TFBGA (12x12)
You May Also Be Interested In
