LPC3141FET180,551
NXP USA Inc.
LPC3141FET180,551
NXP USA Inc.
IC MCU 16/32BIT ROMLESS 180TFBGA
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Product details
The LPC3141FET180,551 from NXP USA Inc. sets new standards in Embedded - Microcontrollers for building automation systems. Its multi-protocol wireless capabilities and ultra-low power architecture make it perfect for smart HVAC controls and IoT-enabled lighting systems.Featuring ARM926EJ-S technology, this microcontroller executes building control algorithms while consuming just 15 A/MHz in active mode.The 16/32-Bit architecture processes multiple sensor inputs simultaneously, enabling complex occupancy detection algorithms with 99% accuracy.Operating at 270MHz, the device maintains sub-millisecond response times for critical safety systems like smoke detection and emergency lighting control.With EBI/EMI, I²C, IrDA, Memory Card, PCM, SPI, UART/USART, USB OTG support, the microcontroller seamlessly bridges between wired BACnet and wireless Zigbee networks in hybrid building automation systems.Integrated DMA, I²S, LCD, PWM, WDT include precision temperature sensors and humidity measurement circuits that eliminate external components in climate control applications.20 configurable interfaces support both digital control signals and analog sensor inputs common in building management panels.The ROMless implementation enables secure over-the-air updates for field upgrades without physical access to installed devices.192K x 8 of retention memory preserves system state during power outages, ensuring immediate recovery in critical life safety systems.The 1.1V ~ 3.6V range supports direct operation from 4-20mA current loops commonly used in building automation sensors.Precision A/D 4x10b achieve 0.5 C accuracy in temperature measurement for precise climate control in sensitive environments.The External maintains timing accuracy during battery operation, enabling 10-year operation from a single coin cell in wireless sensors.Rated for -40°C ~ 85°C (TA), the device operates reliably in unconditioned spaces like attics and mechanical rooms.Surface Mount packaging withstands vibration and mechanical stress encountered in HVAC equipment installations.The 180-TFBGA provides enhanced ESD protection for reliable operation in electrically noisy building environments.Available in 180-TFBGA (12x12), the microcontroller is pre-certified for global building automation standards including EN 14908.
Product Attributes
- Product Status: Obsolete
- Core Processor: ARM926EJ-S
- Core Size: 16/32-Bit
- Speed: 270MHz
- Connectivity: EBI/EMI, I²C, IrDA, Memory Card, PCM, SPI, UART/USART, USB OTG
- Peripherals: DMA, I²S, LCD, PWM, WDT
- Number of I/O: 20
- Program Memory Size: -
- Program Memory Type: ROMless
- EEPROM Size: -
- RAM Size: 192K x 8
- Voltage - Supply (Vcc/Vdd): 1.1V ~ 3.6V
- Data Converters: A/D 4x10b
- Oscillator Type: External
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 180-TFBGA
- Supplier Device Package: 180-TFBGA (12x12)
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