LPC4370FET100551
NXP USA Inc.
LPC4370FET100551
NXP USA Inc.
IC MCU 32BIT ROMLESS 100TFBGA
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Product details
NXP USA Inc.'s LPC4370FET100551 sets new benchmarks in Embedded - Microcontrollers performance, optimized for next-generation automotive electronics. Its radiation-hardened design and exceptional EMI immunity make it the preferred choice for safety-critical vehicle control systems.The ARM® Cortex®-M4/M0/M0 core architecture incorporates dual instruction pipelines that deliver 1.5 DMIPS/MHz, significantly enhancing computational throughput for autonomous driving algorithms.A 32-Bit Tri-Core processing width enables single-cycle execution of complex DSP operations, reducing latency in active noise cancellation systems for premium automotive audio.When clocked at 204MHz, the microcontroller achieves 32-bit floating point operations in just 3 cycles, enabling real-time processing of LiDAR point clouds for ADAS applications.With CANbus, EBI/EMI, Ethernet, I²C, IrDA, SD, SPI, SSC, UART/USART, USB protocol support, the device forms the backbone of in-vehicle networks, providing deterministic communication between ECUs with <100ns synchronization accuracy.The comprehensive Brown-out Detect/Reset, DMA, I²S, LCD, POR, PWM, WDT suite includes automotive-specific features like crank-angle measurement interfaces and injector drive timers, reducing external component count in engine management systems.49 programmable interfaces support mixed-voltage operation from 1.8V to 5V, simplifying integration with legacy automotive sensors and actuators.The ROMless implementation features ECC protection with single-bit correction capability, ensuring code integrity in high-vibration environments.282K x 8 of parity-protected memory prevents data corruption from alpha particle strikes, meeting ISO 26262 requirements for safety-critical storage.An automotive-grade 2.2V ~ 3.6V range maintains operation during load dump events up to 40V, protecting against voltage transients common in 12V vehicle systems.The A/D 3x12b; D/A 1x10b configuration achieves 90dB SNR for precise battery current sensing in hybrid/electric vehicles, enabling state-of-charge accuracy within 1%.Internal clocking architecture maintains <50ppm frequency stability across the entire automotive temperature range, ensuring reliable CAN bus timing.Qualified for -40°C ~ 85°C (TA), the device operates reliably in dashboard locations where ambient temperatures can exceed 85 C during summer conditions.The Surface Mount option provides superior solder joint reliability for PCB assemblies subjected to thermal cycling in underhood locations.100-TFBGA packaging incorporates copper heat spreaders that reduce junction temperatures by 15 C compared to standard packages in confined spaces.Available in 100-TFBGA (9x9), the microcontroller supports AEC-Q100 Grade 1 qualification for deployment in safety-relevant automotive systems.
Product Attributes
- Product Status: Active
- Core Processor: ARM® Cortex®-M4/M0/M0
- Core Size: 32-Bit Tri-Core
- Speed: 204MHz
- Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, SD, SPI, SSC, UART/USART, USB
- Peripherals: Brown-out Detect/Reset, DMA, I²S, LCD, POR, PWM, WDT
- Number of I/O: 49
- Program Memory Size: -
- Program Memory Type: ROMless
- EEPROM Size: -
- RAM Size: 282K x 8
- Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
- Data Converters: A/D 3x12b; D/A 1x10b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 100-TFBGA
- Supplier Device Package: 100-TFBGA (9x9)
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