LPC5514JBD64E
NXP USA Inc.
LPC5514JBD64E
NXP USA Inc.
IC MCU 32BIT 128KB FLASH 64HTQFP
Reference Price (USD)
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$7.49000
500+
$7.4151
1000+
$7.3402
1500+
$7.2653
2000+
$7.1904
2500+
$7.1155
Exquisite packaging
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LPC5514JBD64E
$7.49
Product details
NXP USA Inc.'s LPC5514JBD64E redefines edge computing in Embedded - Microcontrollers, optimized for AI-powered vision systems. Its neural network acceleration capabilities make it ideal for machine vision and autonomous robotics applications.The ARM® Cortex®-M33 architecture incorporates vector processing units that deliver 4 TOPS/W efficiency for real-time object detection algorithms.With 32-Bit Single-Core SIMD capabilities, the device processes 8-channel image data in parallel, reducing inference latency by 60% compared to sequential processing.When operating at 150MHz, the microcontroller performs 1024-point convolutions in just 15 clock cycles, enabling 60fps processing of HD video streams.The CANbus, Flexcomm, I²C, SPI, UART/USART, USB interfaces support MIPI-CSI2 camera inputs with on-the-fly image preprocessing for reduced memory bandwidth requirements.Integrated Brown-out Detect/Reset, DMA, I²S, POR, PWM, RNG, WDT include hardware-accelerated activation functions and pooling layers that eliminate software bottlenecks in deep learning pipelines.36 high-speed GPIOs support parallel sensor interfaces for multi-camera rigs used in 3D reconstruction applications.128KB (128K x 8) accommodates quantized neural network models with space remaining for traditional computer vision algorithms.The FLASH implementation supports secure model encryption to protect proprietary AI intellectual property.80K x 8 of low-latency memory enables double-buffering of video frames while maintaining 30% capacity for neural network activations.The 1.8V ~ 3.6V range supports dynamic voltage scaling from 0.8V to 1.2V, optimizing power efficiency based on processing load.High-speed A/D 10x16b SAR sample image sensor analog outputs with 10-bit resolution at 100MSPS, eliminating the need for external ADCs.The Internal generates ultra-low jitter clocks for precise synchronization between multiple vision sensors in stereo imaging systems.Rated for -40°C ~ 105°C (TA), the device maintains accuracy in industrial environments with rapid temperature fluctuations.Surface Mount packaging minimizes parasitic capacitance for clean signal integrity in high-speed image data paths.The 64-TQFP Exposed Pad incorporates EMI shielding to prevent interference with sensitive analog image sensors in medical imaging applications.Available in 64-HTQFP (10x10), the microcontroller includes production-ready neural network optimization tools for rapid deployment.
Product Attributes
- Product Status: Active
- Core Processor: ARM® Cortex®-M33
- Core Size: 32-Bit Single-Core
- Speed: 150MHz
- Connectivity: CANbus, Flexcomm, I²C, SPI, UART/USART, USB
- Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, RNG, WDT
- Number of I/O: 36
- Program Memory Size: 128KB (128K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 80K x 8
- Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
- Data Converters: A/D 10x16b SAR
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 64-TQFP Exposed Pad
- Supplier Device Package: 64-HTQFP (10x10)
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