LPC810M021FN8129
NXP USA Inc.
Product details
The LPC810M021FN8129 by NXP USA Inc. is a breakthrough in Embedded - Microcontrollers, specifically designed for renewable energy systems. Its advanced power management architecture and grid synchronization capabilities make it perfect for solar inverters and wind turbine controllers.Featuring ARM® Cortex®-M0+ technology, this microcontroller executes complex MPPT algorithms in real-time while maintaining less than 2% THD in power conversion applications.The 32-Bit Single-Core processing architecture enables simultaneous voltage and current waveform analysis, crucial for three-phase grid-tied inverters requiring precise harmonic compensation.Operating at 30MHz, the device performs 64-point FFT calculations within 50 s, enabling rapid detection of grid anomalies in distributed generation systems.I²C, SPI, UART/USART interfaces support Power Line Communication protocols, allowing direct data transmission over existing AC wiring in smart metering applications.Integrated Brown-out Detect/Reset, POR, PWM, WDT include dedicated PWM timers with dead-band control for driving IGBT modules in high-efficiency power conversion stages.With 6 optically isolated inputs, the microcontroller can directly interface with high-voltage sensing circuits in utility-scale power equipment.4KB (4K x 8) accommodates complete IEC 61850-compliant communication stacks alongside application code for substation automation devices.The FLASH implementation features shadow memory for fail-safe firmware updates during continuous operation of critical power infrastructure.1K x 8 of battery-backed RAM maintains system state during brief grid outages, ensuring seamless re-synchronization when power returns.The 1.8V ~ 3.6V range supports direct operation from PV strings up to 1000V DC through integrated buck converters.The Internal maintains 0.01% frequency stability for accurate phasor measurement in smart grid synchronization applications.Rated for -40°C ~ 85°C (TA), the device operates reliably in solar farm environments where module temperatures can exceed 85 C.Through Hole packaging withstands high humidity and salt spray conditions encountered in coastal wind power installations.The 8-DIP (0.300", 7.62mm) provides 5kV isolation between high-voltage and control circuits, meeting UL 1741 safety requirements.Available in 8-DIP, the microcontroller undergoes rigorous testing for electromagnetic compatibility in high-noise power environments.
Product Attributes
- Product Status: Active
- Core Processor: ARM® Cortex®-M0+
- Core Size: 32-Bit Single-Core
- Speed: 30MHz
- Connectivity: I²C, SPI, UART/USART
- Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
- Number of I/O: 6
- Program Memory Size: 4KB (4K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 1K x 8
- Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
- Data Converters: -
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: Through Hole
- Package / Case: 8-DIP (0.300", 7.62mm)
- Supplier Device Package: 8-DIP