LS101MASE7EHA
NXP USA Inc.
Product details
The LS101MASE7EHA from NXP USA Inc. delivers automotive-grade performance in the Embedded - Microprocessors segment, developed for next-generation vehicle electronics. This AEC-Q100 qualified microprocessor combines functional safety features with high computational density, meeting stringent automotive reliability requirements.Based on the ARM1136JF-S architecture, the processor delivers ASIL-D compliant performance for safety-critical automotive applications.The 1 Core, 32-Bit configuration provides redundant processing paths required for fault-tolerant automotive systems.With operating speeds up to 650MHz, the device meets the real-time requirements of advanced driver assistance systems (ADAS).Automotive-grade DDR2 memory interfaces include ECC protection for enhanced data reliability in safety-critical systems.No graphics support enables rendering of high-resolution instrument clusters and head-up displays.GbE (2) implementations provide the backbone for automotive Ethernet networks supporting time-sensitive applications.USB 2.0 + PHY (1) interfaces meet automotive USB standards for reliable connectivity with in-vehicle infotainment systems.Qualified for 0°C ~ 70°C (TA) operation, the processor functions reliably in extreme automotive environments.The 448-FBGA Exposed Pad package meets automotive reliability standards for thermal cycling and mechanical stress.Available in 448-PBGA w/Heat Spreader (23x23), the device supports automotive PCB assembly processes.
Product Attributes
- Product Status: Obsolete
- Core Processor: ARM1136JF-S
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 650MHz
- Co-Processors/DSP: -
- RAM Controllers: DDR2
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: GbE (2)
- SATA: -
- USB: USB 2.0 + PHY (1)
- Voltage - I/O: -
- Operating Temperature: 0°C ~ 70°C (TA)
- Security Features: -
- Package / Case: 448-FBGA Exposed Pad
- Supplier Device Package: 448-PBGA w/Heat Spreader (23x23)