LS1021AXE7HNB557
Freescale Semiconductor
LS1021AXE7HNB557
Freescale Semiconductor
32BIT ARM SOC, 800MHZ, DDR3/4, L
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Product details
The LS1021AXE7HNB557 by Freescale Semiconductor establishes new performance benchmarks in the Embedded - Microprocessors sector, architected for AI-powered edge computing solutions. This neural processing-optimized microprocessor combines heterogeneous computing with advanced thermal management, delivering unprecedented TOPS/Watt efficiency for deep learning inference at the edge.Featuring a ARM® Cortex®-A7 neural engine, this SoC achieves optimal tensor processing performance while maintaining power budgets critical for always-on AI applications.With 2 Core, 32-Bit architecture, the processor enables parallel execution of multiple neural networks while maintaining cache coherency across compute domains.Operating at 800MHz, the device meets the real-time processing requirements of convolutional neural networks in vision-based industrial inspection systems.The Multimedia; NEON™ SIMD neural accelerators deliver 16-bit floating point performance optimized for AI inference tasks.The DDR3L, DDR4 memory subsystem provides the bandwidth necessary for weight streaming in large-scale neural network implementations.Supporting 2D-ACE outputs, the processor drives multiple high-resolution displays for AI visualization dashboards.GbE (3) connectivity enables distributed AI processing across edge nodes with precise time synchronization.SATA 6Gbps (1) interfaces provide high-speed storage for AI model repositories and inference datasets.The USB 2.0 (1), USB 3.0 + PHY interfaces support high-speed data acquisition from industrial cameras and sensors for machine vision applications.Rated for -40°C ~ 105°C (TA) operation, the processor reliably functions in uncontrolled edge computing environments.AI-oriented Secure Boot, TrustZone® include model encryption and secure model update mechanisms for protected edge AI deployments.The 525-FBGA, FCBGA package incorporates advanced heat spreading technology for sustained AI workloads.Available in 525-FCPBGA (19x19), the device supports both conventional and high-density interconnect PCB designs.
Product Attributes
- Product Status: Active
- Core Processor: ARM® Cortex®-A7
- Number of Cores/Bus Width: 2 Core, 32-Bit
- Speed: 800MHz
- Co-Processors/DSP: Multimedia; NEON™ SIMD
- RAM Controllers: DDR3L, DDR4
- Graphics Acceleration: -
- Display & Interface Controllers: 2D-ACE
- Ethernet: GbE (3)
- SATA: SATA 6Gbps (1)
- USB: USB 2.0 (1), USB 3.0 + PHY
- Voltage - I/O: -
- Operating Temperature: -40°C ~ 105°C (TA)
- Security Features: Secure Boot, TrustZone®
- Package / Case: 525-FBGA, FCBGA
- Supplier Device Package: 525-FCPBGA (19x19)
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