LX2160XE72029B
NXP USA Inc.
Product details
The LX2160XE72029B by NXP USA Inc. establishes new performance benchmarks in the Embedded - Microprocessors sector, architected for AI-powered edge computing solutions. This neural processing-optimized microprocessor combines heterogeneous computing with advanced thermal management, delivering unprecedented TOPS/Watt efficiency for deep learning inference at the edge.Featuring a ARM® Cortex®-A72 neural engine, this SoC achieves optimal tensor processing performance while maintaining power budgets critical for always-on AI applications.With 16 Core, 64-Bit architecture, the processor enables parallel execution of multiple neural networks while maintaining cache coherency across compute domains.Operating at 2GHz, the device meets the real-time processing requirements of convolutional neural networks in vision-based industrial inspection systems.The DDR4 memory subsystem provides the bandwidth necessary for weight streaming in large-scale neural network implementations.Yes GPU cores accelerate both traditional rendering and neural network preprocessing tasks simultaneously.100Gbps (2) connectivity enables distributed AI processing across edge nodes with precise time synchronization.SATA 3.0 (4) interfaces provide high-speed storage for AI model repositories and inference datasets.The USB 3.0 (2) + PHY (2) interfaces support high-speed data acquisition from industrial cameras and sensors for machine vision applications.Designed with 1.2V, 1.8V, 3.3V tolerant I/Os, the device maintains signal integrity when interfacing with various industrial sensor networks.Rated for -40°C ~ 105°C (TJ) operation, the processor reliably functions in uncontrolled edge computing environments.AI-oriented Secure Boot, TrustZone® include model encryption and secure model update mechanisms for protected edge AI deployments.The 1517-BBGA, FCBGA package incorporates advanced heat spreading technology for sustained AI workloads.Available in 1517-FCPBGA (40x40), the device supports both conventional and high-density interconnect PCB designs.
Product Attributes
- Product Status: Active
- Core Processor: ARM® Cortex®-A72
- Number of Cores/Bus Width: 16 Core, 64-Bit
- Speed: 2GHz
- Co-Processors/DSP: -
- RAM Controllers: DDR4
- Graphics Acceleration: Yes
- Display & Interface Controllers: -
- Ethernet: 100Gbps (2)
- SATA: SATA 3.0 (4)
- USB: USB 3.0 (2) + PHY (2)
- Voltage - I/O: 1.2V, 1.8V, 3.3V
- Operating Temperature: -40°C ~ 105°C (TJ)
- Security Features: Secure Boot, TrustZone®
- Package / Case: 1517-BBGA, FCBGA
- Supplier Device Package: 1517-FCPBGA (40x40)