LX2162RC82029B
NXP USA Inc.
LX2162RC82029B
NXP USA Inc.
16XA72 64-BIT ARM 2GHZ CAN-FD
Reference Price (USD)
1+
$574.49633
500+
$568.7513667
1000+
$563.0064034
1500+
$557.2614401
2000+
$551.5164768
2500+
$545.7715135
Exquisite packaging
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LX2162RC82029B
$574.50
Product details
The LX2162RC82029B from NXP USA Inc. represents cutting-edge technology in the Embedded - Microprocessors segment, engineered for mission-critical embedded applications. This high-performance microprocessor combines robust architecture with advanced signal processing capabilities, delivering unparalleled computational density for next-generation IoT edge devices.Featuring an ARM® Cortex®-A72 core, this microprocessor achieves optimal balance between power efficiency and processing throughput, making it ideal for real-time signal processing applications where deterministic latency is crucial.With 16 Core, 64-Bit configuration, the device enables parallel processing of complex algorithms while maintaining efficient power distribution across the silicon die.Operating at 2GHz, the processor delivers clock-synchronized performance that meets stringent timing requirements for industrial automation systems and robotic control applications.The integrated DDR4, SDRAM memory controllers provide low-latency access to high-bandwidth memory, essential for data-intensive applications like computer vision and machine learning inference.No graphics support enables the processor to handle sophisticated human-machine interfaces without compromising system responsiveness or power budgets.SATA 6Gbps (4) storage interfaces provide high-speed data throughput for industrial data logging applications requiring reliable non-volatile storage solutions.The USB 3.0 (1) interfaces offer flexible peripheral connectivity options, engineered to meet USB-IF compliance standards for reliable data transfer in harsh environments.Rated for 5°C ~ 105°C (TA) operation, this microprocessor maintains clock synchronization stability even under extreme thermal conditions encountered in automotive underhood applications.The 1150-FBGA package configuration optimizes thermal dissipation while minimizing PCB footprint, crucial for space-constrained embedded designs.Available in 1150-FBGA (23x23), the device offers multiple packaging options to accommodate different manufacturing processes and assembly requirements.
Product Attributes
- Product Status: Active
- Core Processor: ARM® Cortex®-A72
- Number of Cores/Bus Width: 16 Core, 64-Bit
- Speed: 2GHz
- Co-Processors/DSP: -
- RAM Controllers: DDR4, SDRAM
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: -
- SATA: SATA 6Gbps (4)
- USB: USB 3.0 (1)
- Voltage - I/O: -
- Operating Temperature: 5°C ~ 105°C (TA)
- Security Features: -
- Package / Case: 1150-FBGA
- Supplier Device Package: 1150-FBGA (23x23)
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