M2S060-FGG676I
Microchip Technology
M2S060-FGG676I
Microchip Technology
IC SOC CORTEX-M3 166MHZ 676FBGA
Reference Price (USD)
1+
$164.17375
500+
$162.5320125
1000+
$160.890275
1500+
$159.2485375
2000+
$157.6068
2500+
$155.9650625
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
Product details
Microchip Technology's M2S060-FGG676I sets new standards in Embedded - System On Chip (SoC) technology, optimized for industrial automation systems demanding uncompromising reliability. This SoC combines robust electromagnetic compatibility with precise voltage regulation, delivering exceptional performance in harsh manufacturing environments where M2S060-FGG676I excels in noise immunity and long-term stability.The innovative MCU, FPGA architecture incorporates redundant processing elements that provide fault-tolerant operation crucial for safety-critical applications.Powered by the ARM® Cortex®-M3, the device achieves industry-leading deterministic response times while maintaining ultra-low power consumption during idle states.256KB of non-volatile storage supports over-the-air firmware updates and data logging capabilities essential for predictive maintenance systems.With 64KB of error-correcting RAM, the processor ensures data integrity in high-vibration environments typical of factory automation equipment.The rich set of DDR, PCIe, SERDES enables direct sensor interfacing without additional signal conditioning circuits, simplifying system design while improving measurement accuracy.Advanced CANbus, Ethernet, I²C, SPI, UART/USART, USB options facilitate seamless integration with industrial fieldbus networks and legacy control systems alike.The 166MHz operating frequency provides sufficient headroom for complex control algorithms while maintaining precise synchronization across distributed systems.FPGA - 60K Logic Modules deliver hardware-based safety features including watchdog timers and memory protection units required for SIL-3 certified equipment.Designed for -40°C ~ 100°C (TJ) operation, the component withstands thermal cycling stresses encountered in outdoor industrial installations.The rugged 676-BGA construction ensures mechanical stability in high-shock environments while maintaining excellent thermal conductivity.The 676-FBGA (27x27) format enables cost-effective manufacturing while meeting stringent industrial certification requirements.
Product Attributes
- Product Status: Active
- Architecture: MCU, FPGA
- Core Processor: ARM® Cortex®-M3
- Flash Size: 256KB
- RAM Size: 64KB
- Peripherals: DDR, PCIe, SERDES
- Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
- Speed: 166MHz
- Primary Attributes: FPGA - 60K Logic Modules
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 676-BGA
- Supplier Device Package: 676-FBGA (27x27)