M2S090TS-1FCSG325I
Microchip Technology
M2S090TS-1FCSG325I
Microchip Technology
IC SOC CORTEX-M3 166MHZ 325BGA
Reference Price (USD)
1+
$241.03483
500+
$238.6244817
1000+
$236.2141334
1500+
$233.8037851
2000+
$231.3934368
2500+
$228.9830885
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Product details
Engineered for next-generation consumer electronics, Microchip Technology's M2S090TS-1FCSG325I revolutionizes Embedded - System On Chip (SoC) performance in smart home devices. This advanced SoC combines powerful processing with intuitive user interfaces, making M2S090TS-1FCSG325I ideal for voice-controlled assistants where audio signal processing and low-latency response are critical.The multi-core MCU, FPGA architecture enables simultaneous voice recognition, natural language processing, and wireless communication tasks.Featuring the ARM® Cortex®-M3, the device delivers the computational power needed for real-time audio beamforming and noise cancellation algorithms.512KB of secure flash memory stores voice recognition models and user preferences with fast access times.With 64KB of low-latency RAM, the processor ensures smooth performance during complex voice interaction scenarios.Consumer-focused DDR, PCIe, SERDES include high-fidelity audio interfaces and touch controllers for seamless user experiences.The comprehensive CANbus, Ethernet, I²C, SPI, UART/USART, USB suite supports all major smart home protocols while maintaining robust wireless performance.Operating at 166MHz, the processor meets the real-time requirements of always-listening voice interfaces.FPGA - 90K Logic Modules include hardware-accelerated neural network processing for on-device AI capabilities.Rated for -40°C ~ 100°C (TJ), the component maintains reliable operation in various home environments.The 325-TFBGA, FCBGA package enables sleek, compact designs without compromising thermal performance.Available in 325-FCBGA (11x13.5), the device supports high-volume consumer electronics manufacturing.
Product Attributes
- Product Status: Active
- Architecture: MCU, FPGA
- Core Processor: ARM® Cortex®-M3
- Flash Size: 512KB
- RAM Size: 64KB
- Peripherals: DDR, PCIe, SERDES
- Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
- Speed: 166MHz
- Primary Attributes: FPGA - 90K Logic Modules
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 325-TFBGA, FCBGA
- Supplier Device Package: 325-FCBGA (11x13.5)