M2S090TS-1FGG676I
Microchip Technology
M2S090TS-1FGG676I
Microchip Technology
IC SOC CORTEX-M3 166MHZ 676FBGA
Reference Price (USD)
1+
$385.22700
500+
$381.37473
1000+
$377.52246
1500+
$373.67019
2000+
$369.81792
2500+
$365.96565
Exquisite packaging
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M2S090TS-1FGG676I
$385.23
Product details
The M2S090TS-1FGG676I by Microchip Technology is a breakthrough in Embedded - System On Chip (SoC), designed for ultra-low-power IoT edge devices. This SoC combines energy-efficient processing with advanced sleep modes, making it perfect for battery-powered applications where power consumption and signal integrity are crucial for extended operational life.Utilizing a MCU, FPGA architecture, the device achieves unprecedented power efficiency while maintaining reliable data throughput for sensor fusion applications.The ARM® Cortex®-M3 core delivers optimal performance-per-watt ratios, enabling complex edge AI computations within tight energy budgets.512KB of flash memory provides sufficient storage for machine learning models and over-the-air update capabilities in remote deployments.With 64KB of ultra-low-leakage RAM, the processor maintains data retention during deep sleep modes critical for energy harvesting systems.Integrated DDR, PCIe, SERDES include precision ADCs and wireless interfaces that eliminate the need for external components in compact designs.The CANbus, Ethernet, I²C, SPI, UART/USART, USB options support both short-range and LPWAN protocols, ensuring seamless integration into diverse IoT ecosystems.Operating at 166MHz, the processor balances performance with power efficiency for always-on sensing applications.FPGA - 90K Logic Modules feature hardware-accelerated encryption engines that secure device-to-cloud communications without compromising battery life.Rated for -40°C ~ 100°C (TJ), the component maintains reliable operation in extreme environmental monitoring applications.The 676-BGA package enables ultra-compact designs while providing robust thermal characteristics.Available in 676-FBGA (27x27), the device supports automated assembly processes for high-volume IoT product manufacturing.
Product Attributes
- Product Status: Active
- Architecture: MCU, FPGA
- Core Processor: ARM® Cortex®-M3
- Flash Size: 512KB
- RAM Size: 64KB
- Peripherals: DDR, PCIe, SERDES
- Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
- Speed: 166MHz
- Primary Attributes: FPGA - 90K Logic Modules
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 676-BGA
- Supplier Device Package: 676-FBGA (27x27)
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