M82172G23
NXP USA Inc.
Product details
The M82172G23 by NXP USA Inc. establishes new performance benchmarks in the Embedded - Microprocessors sector, architected for AI-powered edge computing solutions. This neural processing-optimized microprocessor combines heterogeneous computing with advanced thermal management, delivering unprecedented TOPS/Watt efficiency for deep learning inference at the edge.Featuring a ARM® Cortex®-A9 neural engine, this SoC achieves optimal tensor processing performance while maintaining power budgets critical for always-on AI applications.With 2 Core, 32-Bit architecture, the processor enables parallel execution of multiple neural networks while maintaining cache coherency across compute domains.Operating at 1.2GHz, the device meets the real-time processing requirements of convolutional neural networks in vision-based industrial inspection systems.The DDR3 memory subsystem provides the bandwidth necessary for weight streaming in large-scale neural network implementations.GbE (3) connectivity enables distributed AI processing across edge nodes with precise time synchronization.SATA 3Gbps (2) interfaces provide high-speed storage for AI model repositories and inference datasets.The USB 2.0 + PHY (1), USB 3.0 + PHY interfaces support high-speed data acquisition from industrial cameras and sensors for machine vision applications.Rated for 0°C ~ 70°C (TA) operation, the processor reliably functions in uncontrolled edge computing environments.AI-oriented Secure Boot, TrustZone® include model encryption and secure model update mechanisms for protected edge AI deployments.The 672-BGA package incorporates advanced heat spreading technology for sustained AI workloads.Available in 672-TEPBGA (27x27), the device supports both conventional and high-density interconnect PCB designs.
Product Attributes
- Product Status: Obsolete
- Core Processor: ARM® Cortex®-A9
- Number of Cores/Bus Width: 2 Core, 32-Bit
- Speed: 1.2GHz
- Co-Processors/DSP: -
- RAM Controllers: DDR3
- Graphics Acceleration: -
- Display & Interface Controllers: -
- Ethernet: GbE (3)
- SATA: SATA 3Gbps (2)
- USB: USB 2.0 + PHY (1), USB 3.0 + PHY
- Voltage - I/O: -
- Operating Temperature: 0°C ~ 70°C (TA)
- Security Features: Secure Boot, TrustZone®
- Package / Case: 672-BGA
- Supplier Device Package: 672-TEPBGA (27x27)