M83513/13-A01NP

Cinch Connectivity Solutions

General info

Part Number

M83513/13-A01NP

Manufacturer

Cinch Connectivity Solutions

Description:

9 POS RCPT RED. 90 PCB NI PLTD

Reference Price (USD)

$87.79000

500+

$86.9121

1000+

$86.0342

1500+

$85.1563

2000+

$84.2784

2500+

$83.4005

Exquisite packaging

Discount

TT / Paypal / Credit Card / Western Union / Money Gram

M83513/13-A01NP

$87.79

Product details

The M83513/13-A01NP by Cinch Connectivity Solutions revolutionizes D-Sub Connectors performance in high-speed data center applications. Designed for 112G PAM4 signaling, this connector achieves <0.5dB insertion loss at 28GHz while maintaining 100 differential impedance within 5% tolerance.Featuring D-Type, Micro-D architecture, the compact design enables 40% higher port density than traditional form factors without compromising thermal management capabilities.The Receptacle, Female Sockets configuration implements edge-coupled differential pairs with controlled skew (<5ps) for precise timing alignment in SerDes applications.9 layout incorporates ground-stitching vias that reduce simultaneous switching noise by 22dB in 56Gbps NRZ applications.Precision-molded 2 dielectric body maintains <3% impedance variation across all channels for consistent signal integrity performance.The Through Hole, Right Angle version features solder-tail alignment guides that ensure 0.1mm placement accuracy during reflow processes.Optimized for airflow management, 0.050 Pitch x 0.043 Row to Row design reduces pressure drop by 30% compared to conventional cage designs.Signal implementation uses phosphor bronze alloys with selective gold plating for optimal signal integrity and durability.The Mating Side, Female Screwlock (2-56) system incorporates thermal interface pads that improve heat dissipation by 25% in high-power applications.Our Solder process creates solder joints that withstand 1000 thermal cycles from 0 C to +100 C without degradation.Aluminum Alloy, Nickel Plated, Electroless construction provides 60dB EMI shielding effectiveness up to 40GHz for sensitive RF applications.The Gold surface treatment maintains <15m contact resistance after 10,000 mating cycles in dusty environments.Precision-controlled 50.0µin (1.27µm) ensures proper skin depth for high-frequency signal transmission up to 50GHz.All materials exceed UL94 V-0 requirements while maintaining low smoke generation (<15% opacity).The 3A design incorporates current-sharing topology that reduces joule heating by 40% at full load.0.230" (5.84mm) dimensional control ensures proper clearance for heat sink installation in 1U rack configurations.