MC68302CEH20C-NXP
NXP USA Inc.
MC68302CEH20C-NXP
NXP USA Inc.
INTEGRATED MULTIPROTOCOL MICROPR
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Product details
NXP USA Inc.'s MC68302CEH20C-NXP revolutionizes the Embedded - Microprocessors market with its 5G-optimized architecture, tailored for next-generation communication infrastructure. This high-performance microprocessor combines advanced signal processing with ultra-low latency characteristics, enabling breakthrough performance in baseband processing applications.The M68000 core architecture delivers the instruction-level parallelism required for efficient baseband processing in 5G NR systems.With 1 Core, 8/16-Bit configuration, the processor achieves optimal resource utilization for massive MIMO processing workloads.Operating at 20MHz, the device meets the stringent timing requirements of 5G fronthaul and midhaul interfaces.The Communications; RISC CPM units accelerate OFDM processing and channel coding algorithms.High-bandwidth DRAM memory interfaces support the massive data flows characteristic of 5G signal processing.No graphics capabilities enable visualization of network performance metrics in real-time.5V tolerant I/Os ensure reliable operation in electrically noisy base station environments.Rated for -40°C ~ 85°C (TA) operation, the processor maintains performance in outdoor radio unit installations.The 132-BQFP Bumpered package design optimizes thermal performance for continuous high-load operation.Available in 132-PQFP (24.13x24.13), the device supports high-reliability PCB manufacturing processes.
Product Attributes
- Product Status: Active
- Core Processor: M68000
- Number of Cores/Bus Width: 1 Core, 8/16-Bit
- Speed: 20MHz
- Co-Processors/DSP: Communications; RISC CPM
- RAM Controllers: DRAM
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: -
- SATA: -
- USB: -
- Voltage - I/O: 5V
- Operating Temperature: -40°C ~ 85°C (TA)
- Security Features: -
- Package / Case: 132-BQFP Bumpered
- Supplier Device Package: 132-PQFP (24.13x24.13)
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