MC68HC705SR3CP
NXP USA Inc.
MC68HC705SR3CP
NXP USA Inc.
IC MCU 8BIT 3.75KB OTP 40DIP
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Product details
NXP USA Inc.'s MC68HC705SR3CP delivers military-grade reliability in Embedded - Microcontrollers, developed for aerospace and defense applications where radiation tolerance and mission longevity are paramount.The HC05 core incorporates triple modular redundancy for SEU mitigation, achieving >99% single-event upset immunity in orbital radiation environments.A 8-Bit architecture with parity-protected data paths prevents silent data corruption, meeting MIL-STD-883G requirements for spaceborne electronics.When operating at 4MHz, the microcontroller maintains timing accuracy within 0.01% despite temperature variations from -55 C to 125 C, critical for navigation systems.LED, POR include radiation-hardened timers and watchdog circuits that automatically recover from single-event functional interrupts within 10 s.With 32 MIL-STD-1553-compatible interfaces, the device can serve as a remote terminal in distributed avionics architectures without external transceivers.3.75KB (3.75K x 8) of TMR-protected storage accommodates flight control algorithms with full error detection and correction capabilities.The OTP implementation uses SONOS technology that withstands 300krad total ionizing dose, exceeding space qualification requirements.192 x 8 of scrubable memory prevents accumulation of single-event upsets, maintaining data integrity during extended missions in high-radiation orbits.The 3V ~ 5.5V range supports operation from unregulated spacecraft power buses with 100mV ripple, eliminating need for additional regulation stages.Precision A/D 4x8b maintain 12-bit accuracy during solar flare events, providing reliable telemetry data even during peak radiation periods.The Internal clock source incorporates automatic frequency compensation that maintains <1ppm/ C drift across the military temperature range.Qualified for -40°C ~ 85°C (TA), the device operates reliably in exoatmospheric conditions where thermal cycling extremes exceed commercial specifications.Through Hole packaging uses AuSn die attach for superior thermal conductivity in vacuum environments, preventing die delamination during thermal transients.The 40-DIP (0.600", 15.24mm) format provides hermetic sealing against moisture ingress, meeting MIL-PRF-38534 Class K requirements for high-reliability applications.Available in 40-PDIP, the microcontroller undergoes rigorous screening including burn-in and 100% electrical testing at temperature extremes.
Product Attributes
- Product Status: Obsolete
- Core Processor: HC05
- Core Size: 8-Bit
- Speed: 4MHz
- Connectivity: -
- Peripherals: LED, POR
- Number of I/O: 32
- Program Memory Size: 3.75KB (3.75K x 8)
- Program Memory Type: OTP
- EEPROM Size: -
- RAM Size: 192 x 8
- Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
- Data Converters: A/D 4x8b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: Through Hole
- Package / Case: 40-DIP (0.600", 15.24mm)
- Supplier Device Package: 40-PDIP
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